Ultrathin Silicon Micropackaging for RF MEMS Devices

In this paper we report a technology for lightweight, small radio-frequency (rf) microelectromechanical system packaging with a short electrical path length. We used an ultrathin silicon substrate as the packaging substrate. Via holes for vertical feed-through were fabricated on the thin silicon waf...

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Veröffentlicht in:	Electrochemical and solid-state letters 2006-01, Vol.9 (2), p.G44-G48
Hauptverfasser:	Kim, Y.-K., Park, Y.-K., Kim, J.-K., Kim, S.-W., Ju, B.-K.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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