Characterization of the laser cleaving on glass sheets with a line-shape laser beam
A CO 2 laser with a line-shape beam was used to cleave a soda-lime glass substrate at various beam-rotation angles to the cutting direction. The stress distribution on the glass substrate cleaved by the laser beam has been analyzed in this study. An uncoupled thermal-elastic analysis was achieved by...
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| Veröffentlicht in: | Optics and laser technology 2007-07, Vol.39 (5), p.892-899 |
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| container_title | Optics and laser technology |
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| creator | Wang, Yu-Zan Lin, Jehnming |
| description | A CO
2 laser with a line-shape beam was used to cleave a soda-lime glass substrate at various beam-rotation angles to the cutting direction. The stress distribution on the glass substrate cleaved by the laser beam has been analyzed in this study. An uncoupled thermal-elastic analysis was achieved by the ABAQUS software based on the finite element method. The numerical results show that the stress field of the fracture is caused by a complex stress state and the cleavages are significantly affected by the heat diffusion and beam rotation angle. At the rotation angle of zero degree to the cleaving direction, the phenomena of the chip formation have been found due to a large temperature gradient at the cleaving depth of the glass substrate. |
| doi_str_mv | 10.1016/j.optlastec.2006.07.005 |
| format | Article |
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2 laser with a line-shape beam was used to cleave a soda-lime glass substrate at various beam-rotation angles to the cutting direction. The stress distribution on the glass substrate cleaved by the laser beam has been analyzed in this study. An uncoupled thermal-elastic analysis was achieved by the ABAQUS software based on the finite element method. The numerical results show that the stress field of the fracture is caused by a complex stress state and the cleavages are significantly affected by the heat diffusion and beam rotation angle. At the rotation angle of zero degree to the cleaving direction, the phenomena of the chip formation have been found due to a large temperature gradient at the cleaving depth of the glass substrate.</description><identifier>ISSN: 0030-3992</identifier><identifier>EISSN: 1879-2545</identifier><identifier>DOI: 10.1016/j.optlastec.2006.07.005</identifier><identifier>CODEN: OLTCAS</identifier><language>eng</language><publisher>Oxford: Elsevier Ltd</publisher><subject>Biological and medical applications ; CO 2 laser cleaving ; Exact sciences and technology ; Fundamental areas of phenomenology (including applications) ; Industrial applications ; Optics ; Physics ; Thermo-elastic analysis</subject><ispartof>Optics and laser technology, 2007-07, Vol.39 (5), p.892-899</ispartof><rights>2006 Elsevier Ltd</rights><rights>2007 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c376t-4088cdddc85d2890f8e318253c01cf23cc537f7e58ef0216cd8a5ca6156657113</citedby><cites>FETCH-LOGICAL-c376t-4088cdddc85d2890f8e318253c01cf23cc537f7e58ef0216cd8a5ca6156657113</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S0030399206001332$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3536,27903,27904,65309</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=18585788$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Wang, Yu-Zan</creatorcontrib><creatorcontrib>Lin, Jehnming</creatorcontrib><title>Characterization of the laser cleaving on glass sheets with a line-shape laser beam</title><title>Optics and laser technology</title><description>A CO
2 laser with a line-shape beam was used to cleave a soda-lime glass substrate at various beam-rotation angles to the cutting direction. The stress distribution on the glass substrate cleaved by the laser beam has been analyzed in this study. An uncoupled thermal-elastic analysis was achieved by the ABAQUS software based on the finite element method. The numerical results show that the stress field of the fracture is caused by a complex stress state and the cleavages are significantly affected by the heat diffusion and beam rotation angle. At the rotation angle of zero degree to the cleaving direction, the phenomena of the chip formation have been found due to a large temperature gradient at the cleaving depth of the glass substrate.</description><subject>Biological and medical applications</subject><subject>CO 2 laser cleaving</subject><subject>Exact sciences and technology</subject><subject>Fundamental areas of phenomenology (including applications)</subject><subject>Industrial applications</subject><subject>Optics</subject><subject>Physics</subject><subject>Thermo-elastic analysis</subject><issn>0030-3992</issn><issn>1879-2545</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><recordid>eNqFkE1v2zAMhoWhBZZm-w3TZb3Zpazow8cg6NoBAXbYdhY0mo4VOHYqKSm2X18HydpjTwTI9wN8GPsioBQg9N22HPe59ykTlhWALsGUAOoDmwlr6qJSC3XFZgASClnX1Ud2k9IWABZayRn7uep89Jgphn8-h3HgY8tzR3xKpMixJ38Mw4ZPh820Sjx1RDnx55A77nkfBipS5_f_DX_I7z6x69b3iT5f5pz9_nb_a_VYrH88fF8t1wVKo3OxAGuxaRq0qqlsDa0lKWylJILAtpKISprWkLLUQiU0NtYr9FoorZURQs7Z7Tl3H8enA6XsdiEh9b0faDwkV9VGL4y0k9CchRjHlCK1bh_Dzse_ToA7QXRb9wrRnSA6MG6CODm_Xip8Qt-30Q8Y0pvdKquMPTUszzqa_j0Gii5hoAGpCZEwu2YM73a9ABrJjHw</recordid><startdate>20070701</startdate><enddate>20070701</enddate><creator>Wang, Yu-Zan</creator><creator>Lin, Jehnming</creator><general>Elsevier Ltd</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>L7M</scope></search><sort><creationdate>20070701</creationdate><title>Characterization of the laser cleaving on glass sheets with a line-shape laser beam</title><author>Wang, Yu-Zan ; Lin, Jehnming</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c376t-4088cdddc85d2890f8e318253c01cf23cc537f7e58ef0216cd8a5ca6156657113</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Biological and medical applications</topic><topic>CO 2 laser cleaving</topic><topic>Exact sciences and technology</topic><topic>Fundamental areas of phenomenology (including applications)</topic><topic>Industrial applications</topic><topic>Optics</topic><topic>Physics</topic><topic>Thermo-elastic analysis</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wang, Yu-Zan</creatorcontrib><creatorcontrib>Lin, Jehnming</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Optics and laser technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wang, Yu-Zan</au><au>Lin, Jehnming</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Characterization of the laser cleaving on glass sheets with a line-shape laser beam</atitle><jtitle>Optics and laser technology</jtitle><date>2007-07-01</date><risdate>2007</risdate><volume>39</volume><issue>5</issue><spage>892</spage><epage>899</epage><pages>892-899</pages><issn>0030-3992</issn><eissn>1879-2545</eissn><coden>OLTCAS</coden><abstract>A CO
2 laser with a line-shape beam was used to cleave a soda-lime glass substrate at various beam-rotation angles to the cutting direction. The stress distribution on the glass substrate cleaved by the laser beam has been analyzed in this study. An uncoupled thermal-elastic analysis was achieved by the ABAQUS software based on the finite element method. The numerical results show that the stress field of the fracture is caused by a complex stress state and the cleavages are significantly affected by the heat diffusion and beam rotation angle. At the rotation angle of zero degree to the cleaving direction, the phenomena of the chip formation have been found due to a large temperature gradient at the cleaving depth of the glass substrate.</abstract><cop>Oxford</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.optlastec.2006.07.005</doi><tpages>8</tpages></addata></record> |
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| language | eng |
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| source | Elsevier ScienceDirect Journals |
| subjects | Biological and medical applications CO 2 laser cleaving Exact sciences and technology Fundamental areas of phenomenology (including applications) Industrial applications Optics Physics Thermo-elastic analysis |
| title | Characterization of the laser cleaving on glass sheets with a line-shape laser beam |
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