The Present and Future Trends in Electroless Copper Plating

The Present and Future Trends in Electroless Copper Plating

Abstract not available.

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Hyōmen gijutsu 2007, Vol.58(2), pp.81-81
1. Verfasser: SHIMIZU, Satoru
Format: Artikel
Sprache:jpn
Schlagworte:
Electroless Copper Plating
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 81
container_issue 2
container_start_page 81
container_title Hyōmen gijutsu
container_volume 58
creator SHIMIZU, Satoru
description Abstract not available.
doi_str_mv 10.4139/sfj.58.81
format Article
fullrecord <record><control><sourceid>proquest_jstag</sourceid><recordid>TN_cdi_proquest_miscellaneous_29725736</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>29076804</sourcerecordid><originalsourceid>FETCH-LOGICAL-j1176-9af989e895cadce7885ca73f6d8315286662b317a5be0371e7a903f52cb6f33</originalsourceid><addsrcrecordid>eNqNkE1LAzEYhIMoWGoP_oOcvG3Nx-YLQZDSqlCw4N5DNvtuu2WbXZPswX9voeLZy8zAPMxhELqnZFlSbh5Te1wKvdT0Cs2o1mXBS2Ku0YwYKgqqpblFi5S6mjDBBaO0nKGn6gB4FyFByNiFBm-mPEXAVYTQJNwFvO7B5zj0kBJeDeMIEe96l7uwv0M3resTLH59jj4362r1Vmw_Xt9XL9viSKmShXGt0Qa0Ed41HpTW56B4KxvNqWBaSslqTpUTNRCuKChnCG8F87VsOZ-jh8vqGIevCVK2py556HsXYJiSZUYxobj8B0iU1KQ8g88X8Jiy24MdY3dy8du6mDvfgz3faIW27CKa_hX-4KKFwH8AtJxtnw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>29076804</pqid></control><display><type>article</type><title>The Present and Future Trends in Electroless Copper Plating</title><source>J-STAGE (Japan Science &amp; Technology Information Aggregator, Electronic) Freely Available Titles - Japanese</source><source>EZB-FREE-00999 freely available EZB journals</source><creator>SHIMIZU, Satoru</creator><creatorcontrib>SHIMIZU, Satoru</creatorcontrib><description>Abstract not available.</description><identifier>ISSN: 0915-1869</identifier><identifier>EISSN: 1884-3409</identifier><identifier>DOI: 10.4139/sfj.58.81</identifier><language>jpn</language><publisher>The Surface Finishing Society of Japan</publisher><subject>Electroless Copper Plating</subject><ispartof>Journal of The Surface Finishing Society of Japan, 2007, Vol.58(2), pp.81-81</ispartof><rights>2007 by The Surface Finishing Society of Japan</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,1881,27922,27923</link.rule.ids></links><search><creatorcontrib>SHIMIZU, Satoru</creatorcontrib><title>The Present and Future Trends in Electroless Copper Plating</title><title>Hyōmen gijutsu</title><addtitle>Journal of The Surface Finishing Society of Japan</addtitle><description>Abstract not available.</description><subject>Electroless Copper Plating</subject><issn>0915-1869</issn><issn>1884-3409</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><recordid>eNqNkE1LAzEYhIMoWGoP_oOcvG3Nx-YLQZDSqlCw4N5DNvtuu2WbXZPswX9voeLZy8zAPMxhELqnZFlSbh5Te1wKvdT0Cs2o1mXBS2Ku0YwYKgqqpblFi5S6mjDBBaO0nKGn6gB4FyFByNiFBm-mPEXAVYTQJNwFvO7B5zj0kBJeDeMIEe96l7uwv0M3resTLH59jj4362r1Vmw_Xt9XL9viSKmShXGt0Qa0Ed41HpTW56B4KxvNqWBaSslqTpUTNRCuKChnCG8F87VsOZ-jh8vqGIevCVK2py556HsXYJiSZUYxobj8B0iU1KQ8g88X8Jiy24MdY3dy8du6mDvfgz3faIW27CKa_hX-4KKFwH8AtJxtnw</recordid><startdate>20070201</startdate><enddate>20070201</enddate><creator>SHIMIZU, Satoru</creator><general>The Surface Finishing Society of Japan</general><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>7TB</scope><scope>FR3</scope></search><sort><creationdate>20070201</creationdate><title>The Present and Future Trends in Electroless Copper Plating</title><author>SHIMIZU, Satoru</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-j1176-9af989e895cadce7885ca73f6d8315286662b317a5be0371e7a903f52cb6f33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>jpn</language><creationdate>2007</creationdate><topic>Electroless Copper Plating</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIMIZU, Satoru</creatorcontrib><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Mechanical &amp; Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><jtitle>Hyōmen gijutsu</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>SHIMIZU, Satoru</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The Present and Future Trends in Electroless Copper Plating</atitle><jtitle>Hyōmen gijutsu</jtitle><addtitle>Journal of The Surface Finishing Society of Japan</addtitle><date>2007-02-01</date><risdate>2007</risdate><volume>58</volume><issue>2</issue><spage>81</spage><epage>81</epage><pages>81-81</pages><issn>0915-1869</issn><eissn>1884-3409</eissn><abstract>Abstract not available.</abstract><pub>The Surface Finishing Society of Japan</pub><doi>10.4139/sfj.58.81</doi><tpages>1</tpages><oa>free_for_read</oa></addata></record>
fulltext fulltext
identifier ISSN: 0915-1869
ispartof Journal of The Surface Finishing Society of Japan, 2007, Vol.58(2), pp.81-81
issn 0915-1869
1884-3409
language jpn
recordid cdi_proquest_miscellaneous_29725736
source J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese; EZB-FREE-00999 freely available EZB journals
subjects Electroless Copper Plating
title The Present and Future Trends in Electroless Copper Plating
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T08%3A24%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_jstag&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=The%20Present%20and%20Future%20Trends%20in%20Electroless%20Copper%20Plating&rft.jtitle=Hy%C5%8Dmen%20gijutsu&rft.au=SHIMIZU,%20Satoru&rft.date=2007-02-01&rft.volume=58&rft.issue=2&rft.spage=81&rft.epage=81&rft.pages=81-81&rft.issn=0915-1869&rft.eissn=1884-3409&rft_id=info:doi/10.4139/sfj.58.81&rft_dat=%3Cproquest_jstag%3E29076804%3C/proquest_jstag%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=29076804&rft_id=info:pmid/&rfr_iscdi=true