Tensile properties of in situ consolidated nanocrystalline Cu
We have prepared Cu powders with nanocrystalline grain sizes via ball milling at liquid nitrogen temperature. An in situ consolidation technique was used to produce fully dense nanocrystalline Cu samples centimeters in lateral dimensions and about one millimeter in thickness. We report a much improv...
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Veröffentlicht in: | Acta materialia 2005-03, Vol.53 (5), p.1521-1533 |
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creator | Cheng, S. Ma, E. Wang, Y.M. Kecskes, L.J. Youssef, K.M. Koch, C.C. Trociewitz, U.P. Han, K. |
description | We have prepared Cu powders with nanocrystalline grain sizes via ball milling at liquid nitrogen temperature. An in situ consolidation technique was used to produce fully dense nanocrystalline Cu samples centimeters in lateral dimensions and about one millimeter in thickness. We report a much improved combination of tensile strength and ductility, over the tensile properties of other nanocrystalline Cu materials documented in the literature. We also demonstrate the elevated strain rate sensitivity and strong temperature dependence of the flow stress and explain the results in terms of the thermally activated deformation mechanisms operative in the nanocrystalline grains. The nearly perfectly plastic behavior and shear localization observed are discussed and compared with the strain hardening behavior and deformation modes known for other nanocrystalline metals. |
doi_str_mv | 10.1016/j.actamat.2004.12.005 |
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fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_29712784</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S1359645404007414</els_id><sourcerecordid>28605174</sourcerecordid><originalsourceid>FETCH-LOGICAL-c401t-b0be0de20d8a6673d93b650cd3a560f591e7047688b764695cfb9a7c4252b2a33</originalsourceid><addsrcrecordid>eNqFkMtKxDAUhoMoOI4-gtCN7lpP0lzahYgM3mDAzbgOaXoKGTrpmKTCvL0tM-DS1TmL7z-Xj5BbCgUFKh-2hbHJ7EwqGAAvKCsAxBlZ0EqVOeOiPJ_6UtS55IJfkqsYtwCUKQ4L8rhBH12P2T4MewzJYcyGLnM-iy6NmR18HHrXmoRt5o0fbDjEZPreecxW4zW56Ewf8eZUl-Tr9WWzes_Xn28fq-d1bjnQlDfQILTIoK2MlKps67KRAmxbGiGhEzVFBVzJqmqU5LIWtmtqoyxngjXMlOWS3B_nTld-jxiT3rlose-Nx2GMmtVq-qfi_4OVBEHVDIojaMMQY8BO74PbmXDQFPRsVW_1yaqerWrK9GR1yt2dFphoTd8F462Lf2EpGK_ozD0dOZy0_DgMOlqH3mLrAtqk28H9s-kXo4iPYA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>28605174</pqid></control><display><type>article</type><title>Tensile properties of in situ consolidated nanocrystalline Cu</title><source>ScienceDirect Journals (5 years ago - present)</source><creator>Cheng, S. ; Ma, E. ; Wang, Y.M. ; Kecskes, L.J. ; Youssef, K.M. ; Koch, C.C. ; Trociewitz, U.P. ; Han, K.</creator><creatorcontrib>Cheng, S. ; Ma, E. ; Wang, Y.M. ; Kecskes, L.J. ; Youssef, K.M. ; Koch, C.C. ; Trociewitz, U.P. ; Han, K.</creatorcontrib><description>We have prepared Cu powders with nanocrystalline grain sizes via ball milling at liquid nitrogen temperature. An in situ consolidation technique was used to produce fully dense nanocrystalline Cu samples centimeters in lateral dimensions and about one millimeter in thickness. We report a much improved combination of tensile strength and ductility, over the tensile properties of other nanocrystalline Cu materials documented in the literature. We also demonstrate the elevated strain rate sensitivity and strong temperature dependence of the flow stress and explain the results in terms of the thermally activated deformation mechanisms operative in the nanocrystalline grains. The nearly perfectly plastic behavior and shear localization observed are discussed and compared with the strain hardening behavior and deformation modes known for other nanocrystalline metals.</description><identifier>ISSN: 1359-6454</identifier><identifier>EISSN: 1873-2453</identifier><identifier>DOI: 10.1016/j.actamat.2004.12.005</identifier><language>eng</language><publisher>Oxford: Elsevier Ltd</publisher><subject>Applied sciences ; Consolidation ; Copper ; Deformation mechanism ; Exact sciences and technology ; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology ; Mechanical property ; Metals. Metallurgy ; Nanocrystalline</subject><ispartof>Acta materialia, 2005-03, Vol.53 (5), p.1521-1533</ispartof><rights>2004 Acta Materialia Inc.</rights><rights>2005 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c401t-b0be0de20d8a6673d93b650cd3a560f591e7047688b764695cfb9a7c4252b2a33</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.actamat.2004.12.005$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3548,27923,27924,45994</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=16524815$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Cheng, S.</creatorcontrib><creatorcontrib>Ma, E.</creatorcontrib><creatorcontrib>Wang, Y.M.</creatorcontrib><creatorcontrib>Kecskes, L.J.</creatorcontrib><creatorcontrib>Youssef, K.M.</creatorcontrib><creatorcontrib>Koch, C.C.</creatorcontrib><creatorcontrib>Trociewitz, U.P.</creatorcontrib><creatorcontrib>Han, K.</creatorcontrib><title>Tensile properties of in situ consolidated nanocrystalline Cu</title><title>Acta materialia</title><description>We have prepared Cu powders with nanocrystalline grain sizes via ball milling at liquid nitrogen temperature. An in situ consolidation technique was used to produce fully dense nanocrystalline Cu samples centimeters in lateral dimensions and about one millimeter in thickness. We report a much improved combination of tensile strength and ductility, over the tensile properties of other nanocrystalline Cu materials documented in the literature. We also demonstrate the elevated strain rate sensitivity and strong temperature dependence of the flow stress and explain the results in terms of the thermally activated deformation mechanisms operative in the nanocrystalline grains. The nearly perfectly plastic behavior and shear localization observed are discussed and compared with the strain hardening behavior and deformation modes known for other nanocrystalline metals.</description><subject>Applied sciences</subject><subject>Consolidation</subject><subject>Copper</subject><subject>Deformation mechanism</subject><subject>Exact sciences and technology</subject><subject>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</subject><subject>Mechanical property</subject><subject>Metals. Metallurgy</subject><subject>Nanocrystalline</subject><issn>1359-6454</issn><issn>1873-2453</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><recordid>eNqFkMtKxDAUhoMoOI4-gtCN7lpP0lzahYgM3mDAzbgOaXoKGTrpmKTCvL0tM-DS1TmL7z-Xj5BbCgUFKh-2hbHJ7EwqGAAvKCsAxBlZ0EqVOeOiPJ_6UtS55IJfkqsYtwCUKQ4L8rhBH12P2T4MewzJYcyGLnM-iy6NmR18HHrXmoRt5o0fbDjEZPreecxW4zW56Ewf8eZUl-Tr9WWzes_Xn28fq-d1bjnQlDfQILTIoK2MlKps67KRAmxbGiGhEzVFBVzJqmqU5LIWtmtqoyxngjXMlOWS3B_nTld-jxiT3rlose-Nx2GMmtVq-qfi_4OVBEHVDIojaMMQY8BO74PbmXDQFPRsVW_1yaqerWrK9GR1yt2dFphoTd8F462Lf2EpGK_ozD0dOZy0_DgMOlqH3mLrAtqk28H9s-kXo4iPYA</recordid><startdate>20050301</startdate><enddate>20050301</enddate><creator>Cheng, S.</creator><creator>Ma, E.</creator><creator>Wang, Y.M.</creator><creator>Kecskes, L.J.</creator><creator>Youssef, K.M.</creator><creator>Koch, C.C.</creator><creator>Trociewitz, U.P.</creator><creator>Han, K.</creator><general>Elsevier Ltd</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope><scope>7TB</scope><scope>FR3</scope></search><sort><creationdate>20050301</creationdate><title>Tensile properties of in situ consolidated nanocrystalline Cu</title><author>Cheng, S. ; Ma, E. ; Wang, Y.M. ; Kecskes, L.J. ; Youssef, K.M. ; Koch, C.C. ; Trociewitz, U.P. ; Han, K.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c401t-b0be0de20d8a6673d93b650cd3a560f591e7047688b764695cfb9a7c4252b2a33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Applied sciences</topic><topic>Consolidation</topic><topic>Copper</topic><topic>Deformation mechanism</topic><topic>Exact sciences and technology</topic><topic>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</topic><topic>Mechanical property</topic><topic>Metals. Metallurgy</topic><topic>Nanocrystalline</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Cheng, S.</creatorcontrib><creatorcontrib>Ma, E.</creatorcontrib><creatorcontrib>Wang, Y.M.</creatorcontrib><creatorcontrib>Kecskes, L.J.</creatorcontrib><creatorcontrib>Youssef, K.M.</creatorcontrib><creatorcontrib>Koch, C.C.</creatorcontrib><creatorcontrib>Trociewitz, U.P.</creatorcontrib><creatorcontrib>Han, K.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><jtitle>Acta materialia</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Cheng, S.</au><au>Ma, E.</au><au>Wang, Y.M.</au><au>Kecskes, L.J.</au><au>Youssef, K.M.</au><au>Koch, C.C.</au><au>Trociewitz, U.P.</au><au>Han, K.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Tensile properties of in situ consolidated nanocrystalline Cu</atitle><jtitle>Acta materialia</jtitle><date>2005-03-01</date><risdate>2005</risdate><volume>53</volume><issue>5</issue><spage>1521</spage><epage>1533</epage><pages>1521-1533</pages><issn>1359-6454</issn><eissn>1873-2453</eissn><abstract>We have prepared Cu powders with nanocrystalline grain sizes via ball milling at liquid nitrogen temperature. An in situ consolidation technique was used to produce fully dense nanocrystalline Cu samples centimeters in lateral dimensions and about one millimeter in thickness. We report a much improved combination of tensile strength and ductility, over the tensile properties of other nanocrystalline Cu materials documented in the literature. We also demonstrate the elevated strain rate sensitivity and strong temperature dependence of the flow stress and explain the results in terms of the thermally activated deformation mechanisms operative in the nanocrystalline grains. The nearly perfectly plastic behavior and shear localization observed are discussed and compared with the strain hardening behavior and deformation modes known for other nanocrystalline metals.</abstract><cop>Oxford</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.actamat.2004.12.005</doi><tpages>13</tpages></addata></record> |
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source | ScienceDirect Journals (5 years ago - present) |
subjects | Applied sciences Consolidation Copper Deformation mechanism Exact sciences and technology Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Mechanical property Metals. Metallurgy Nanocrystalline |
title | Tensile properties of in situ consolidated nanocrystalline Cu |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T02%3A14%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Tensile%20properties%20of%20in%20situ%20consolidated%20nanocrystalline%20Cu&rft.jtitle=Acta%20materialia&rft.au=Cheng,%20S.&rft.date=2005-03-01&rft.volume=53&rft.issue=5&rft.spage=1521&rft.epage=1533&rft.pages=1521-1533&rft.issn=1359-6454&rft.eissn=1873-2453&rft_id=info:doi/10.1016/j.actamat.2004.12.005&rft_dat=%3Cproquest_cross%3E28605174%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=28605174&rft_id=info:pmid/&rft_els_id=S1359645404007414&rfr_iscdi=true |