Studies on nanoimprint process parameters of copper by molecular dynamics analysis

A molecular dynamics analysis scheme is proposed to study nanoimprint processes by considering the following effects: temperature, punch velocity, spring back, etc. The nanoimprint process being studied in the proposed paper is similar to nanoimprint lithography, except that the material under inves...

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Veröffentlicht in:	Computational materials science 2005-12, Vol.34 (4), p.314-322
Hauptverfasser:	Hsu, Q.C., Wu, C.D., Fang, T.H.
Format:	Artikel
Sprache:	eng
Schlagworte:	Atomic-structure deformation Cross-disciplinary physics: materials science rheology Exact sciences and technology Materials science Molecular dynamics Nanoimprint process Physics Spring back Surface treatments
Online-Zugang:	Volltext
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