Silicon nitride films by chemical vapor deposition in fluidized bed reactors at atmospheric pressure (AP/FBR-CVD)

Silicon nitride thin films with thicknesses around 1 μm were deposited on AISI316 steel by Chemical Vapor Deposition in a Fluidized Bed Reactor at Atmospheric Pressure (AP/FBR-CVD). The films were obtained by reaction of SiCl 4 and NH 3 in a reducing atmosphere at temperatures in the range 725–775 °...

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Veröffentlicht in:Surface & coatings technology 2005-11, Vol.200 (5), p.1719-1723
Hauptverfasser: Perez-Mariano, J., Borros, S., Picas, J.A., Forn, A., Colominas, C.
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container_end_page 1723
container_issue 5
container_start_page 1719
container_title Surface & coatings technology
container_volume 200
creator Perez-Mariano, J.
Borros, S.
Picas, J.A.
Forn, A.
Colominas, C.
description Silicon nitride thin films with thicknesses around 1 μm were deposited on AISI316 steel by Chemical Vapor Deposition in a Fluidized Bed Reactor at Atmospheric Pressure (AP/FBR-CVD). The films were obtained by reaction of SiCl 4 and NH 3 in a reducing atmosphere at temperatures in the range 725–775 °C. They were amorphous and substoichiometric. Activation of the bed particles through alternating reaction steps resulted in a higher deposition rate. The formation of chromium nitride was detected for several microns beneath the film. The deposition temperature was found to have a great influence in their morphology and mechanical properties. The coatings presented hardness values up to 26 GPa.
doi_str_mv 10.1016/j.surfcoat.2005.08.069
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source Elsevier ScienceDirect Journals
subjects Applied sciences
Chemical Vapor Deposition
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
FBR-CVD
Fluidized bed
Materials science
Metals. Metallurgy
Other topics in materials science
Physics
Production techniques
Silicon nitride
Surface treatment
title Silicon nitride films by chemical vapor deposition in fluidized bed reactors at atmospheric pressure (AP/FBR-CVD)
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