Next-generation microvia and global wiring technologies for SOP

As microsystems continue to move toward higher speed and microminiaturization, the demand for interconnection density both on the IC and the package levels increases tremendously. The 2002 ITRS roadmap update identifies the need for sub-100-/spl mu/m area array pitch and data rates of 10 Gb/s in the...

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Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on advanced packaging 2004-05, Vol.27 (2), p.315-325
Hauptverfasser:	Sundaram, V., Tummala, R.R., Fuhan Liu, Kohl, P.A., Jun Li, Bidstrup-Allen, S.A., Fukuoka, Y.
Format:	Artikel
Sprache:	eng
Schlagworte:	Accumulation Conducting materials Conductors Conductors (devices) Demand Density Dielectric substrates Dielectric thin films Dielectrics High speed integrated circuits Integrated circuit packaging Marketing Packages Printed circuit boards R&D Research & development Space technology Technological innovation Throughput Wiring
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