On the relationship of semiconductor yield and reliability

Traditionally, semiconductor reliability has been estimated from the life tests or accelerated stress tests at the completion of manufacturing processes. Recent research, however, has been directed to reliability estimation during the early production stage through a relation model of yield and reli...

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Veröffentlicht in:	IEEE transactions on semiconductor manufacturing 2005-08, Vol.18 (3), p.422-429
Hauptverfasser:	Kim, K.O., Zuo, M.J., Kuo, W.
Format:	Artikel
Sprache:	eng
Schlagworte:	Accelerated tests Applied sciences Burn-in Conditional reliability defect density distribution Density distribution Devices Electronics Exact sciences and technology Life estimation Life testing Manufacturing processes Mathematical models nonfatal defects Predictive models Preserves Production Repair scaling factor Semiconductor device reliability Semiconductor device testing Semiconductors Stress Studies Testing, measurement, noise and reliability Virtual manufacturing Yield estimation
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