On the relationship of semiconductor yield and reliability
Traditionally, semiconductor reliability has been estimated from the life tests or accelerated stress tests at the completion of manufacturing processes. Recent research, however, has been directed to reliability estimation during the early production stage through a relation model of yield and reli...
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| Veröffentlicht in: | IEEE transactions on semiconductor manufacturing 2005-08, Vol.18 (3), p.422-429 |
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| creator | Kim, K.O. Zuo, M.J. Kuo, W. |
| description | Traditionally, semiconductor reliability has been estimated from the life tests or accelerated stress tests at the completion of manufacturing processes. Recent research, however, has been directed to reliability estimation during the early production stage through a relation model of yield and reliability. Because the relation model depends on the assumed density distribution of manufacturing defects, we investigate the effect of the defect density distributions on the predicted reliability, for a single-area device without repair and for a two-area device with repair, respectively. We show that for any device, reliability functions preserve an ordering of yield functions. It is also pointed out that the repair capability improves only yield but not reliability, resulting in a large value of the factor that scales from yield to reliability. In order to achieve a reliable device, therefore, we suggest to improve yield and to perform the device test such as burn-in if the scaling factor is large. |
| doi_str_mv | 10.1109/TSM.2005.852110 |
| format | Article |
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Recent research, however, has been directed to reliability estimation during the early production stage through a relation model of yield and reliability. Because the relation model depends on the assumed density distribution of manufacturing defects, we investigate the effect of the defect density distributions on the predicted reliability, for a single-area device without repair and for a two-area device with repair, respectively. We show that for any device, reliability functions preserve an ordering of yield functions. It is also pointed out that the repair capability improves only yield but not reliability, resulting in a large value of the factor that scales from yield to reliability. 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Recent research, however, has been directed to reliability estimation during the early production stage through a relation model of yield and reliability. Because the relation model depends on the assumed density distribution of manufacturing defects, we investigate the effect of the defect density distributions on the predicted reliability, for a single-area device without repair and for a two-area device with repair, respectively. We show that for any device, reliability functions preserve an ordering of yield functions. It is also pointed out that the repair capability improves only yield but not reliability, resulting in a large value of the factor that scales from yield to reliability. In order to achieve a reliable device, therefore, we suggest to improve yield and to perform the device test such as burn-in if the scaling factor is large.</description><subject>Accelerated tests</subject><subject>Applied sciences</subject><subject>Burn-in</subject><subject>Conditional reliability</subject><subject>defect density distribution</subject><subject>Density distribution</subject><subject>Devices</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Life estimation</subject><subject>Life testing</subject><subject>Manufacturing processes</subject><subject>Mathematical models</subject><subject>nonfatal defects</subject><subject>Predictive models</subject><subject>Preserves</subject><subject>Production</subject><subject>Repair</subject><subject>scaling factor</subject><subject>Semiconductor device reliability</subject><subject>Semiconductor device testing</subject><subject>Semiconductors</subject><subject>Stress</subject><subject>Studies</subject><subject>Testing, measurement, noise and reliability</subject><subject>Virtual manufacturing</subject><subject>Yield estimation</subject><issn>0894-6507</issn><issn>1558-2345</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqFkc1LxDAQxYMouK6ePXgpguKl66TNpIk3Eb9A8aCeQ5pOMdJt16R72P_erCsIHvQ0MPObx7x5jB1ymHEO-vzl-XFWAOBMYZEaW2zCEVVelAK32QSUFrlEqHbZXozvAFwIXU3YxVOfjW-UBers6Ic-vvlFNrRZpLl3Q98s3TiEbOWpazLbN2vO29p3flzts53WdpEOvuuUvd5cv1zd5Q9Pt_dXlw-5E7wcc6lFi7x16AixEVS2tZK2RudKUG0NtXSkCgsNcE5CoFUoJFAF2DhMhsopO93oLsLwsaQ4mrmPjrrO9jQsoym0kOkB5f-gAlnBl-LZnyCXVXoP51Ik9PgX-j4sQ5_8Gs0LqDAdm6DzDeTCEGOg1iyCn9uwMhzMOhyTwjHrcMwmnLRx8i1ro7NdG2zvfPxZk1qj5DxxRxvOE9HPWOhCoCo_AYJMlaM</recordid><startdate>20050801</startdate><enddate>20050801</enddate><creator>Kim, K.O.</creator><creator>Zuo, M.J.</creator><creator>Kuo, W.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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Recent research, however, has been directed to reliability estimation during the early production stage through a relation model of yield and reliability. Because the relation model depends on the assumed density distribution of manufacturing defects, we investigate the effect of the defect density distributions on the predicted reliability, for a single-area device without repair and for a two-area device with repair, respectively. We show that for any device, reliability functions preserve an ordering of yield functions. It is also pointed out that the repair capability improves only yield but not reliability, resulting in a large value of the factor that scales from yield to reliability. In order to achieve a reliable device, therefore, we suggest to improve yield and to perform the device test such as burn-in if the scaling factor is large.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TSM.2005.852110</doi><tpages>8</tpages></addata></record> |
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| source | IEEE Electronic Library (IEL) |
| subjects | Accelerated tests Applied sciences Burn-in Conditional reliability defect density distribution Density distribution Devices Electronics Exact sciences and technology Life estimation Life testing Manufacturing processes Mathematical models nonfatal defects Predictive models Preserves Production Repair scaling factor Semiconductor device reliability Semiconductor device testing Semiconductors Stress Studies Testing, measurement, noise and reliability Virtual manufacturing Yield estimation |
| title | On the relationship of semiconductor yield and reliability |
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