Interfacial microstructure and strength of lead-free Sn-Zn-RE BGA solder bumps

Rare earth (RE) elements, primarily La and Ce, were doped in Sn-Zn solder to improve its properties such as wettability. The interfacial microstructure evolution and shear strength of the Sn-9Zn and Sn-9Zn-0.5RE (in wt%) solder bumps on Au/Ni/Cu under bump metallization (UBM) in a ball grid array (B...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on advanced packaging 2005-05, Vol.28 (2), p.252-258
Hauptverfasser:	Law, C.M.T., Wu, C.M.L., Yu, D.Q., Li, M., Chi, D.Z.
Format:	Artikel
Sprache:	eng
Schlagworte:	Aging Alloys Applied sciences Ball grid array (BGA) BGA BGA shear strength Design. Technologies. Operation analysis. Testing Earth Electronics Electronics packaging Environmentally friendly manufacturing techniques Exact sciences and technology Gold Integrated circuits interfacial microstructure evolution Intermetallic compounds Lead Materials science and technology Metallization Microstructure Nickel Physics Rare earth metals Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Shear strength Sn-Zn-RE solder ball Solders Tin Tin base alloys
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!