Analytical multipoint moment matching reduction of distributed thermal networks
In this paper, the multipoint moment matching method for model order reduction of discretized linear thermal networks is extended to distributed linear thermal networks. As a result, from the analytical canonical forms of distributed linear thermal networks, reduced thermal networks are derived anal...
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| Veröffentlicht in: | IEEE transactions on components and packaging technologies 2004-03, Vol.27 (1), p.87-95 |
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| container_title | IEEE transactions on components and packaging technologies |
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| creator | Codecasa, L. D'Amore, D. Maffezzoni, P. Batty, W. |
| description | In this paper, the multipoint moment matching method for model order reduction of discretized linear thermal networks is extended to distributed linear thermal networks. As a result, from the analytical canonical forms of distributed linear thermal networks, reduced thermal networks are derived analytically. This direct construction of the reduced network, from the exact analytical solutions, avoids the inevitable inaccuracies inherent in conventional surface and volume meshing. It allows nearly exact reduced thermal network construction by domain decomposition for arbitrarily complicated structures. |
| doi_str_mv | 10.1109/TCAPT.2004.825763 |
| format | Article |
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As a result, from the analytical canonical forms of distributed linear thermal networks, reduced thermal networks are derived analytically. This direct construction of the reduced network, from the exact analytical solutions, avoids the inevitable inaccuracies inherent in conventional surface and volume meshing. It allows nearly exact reduced thermal network construction by domain decomposition for arbitrarily complicated structures.</description><identifier>ISSN: 1521-3331</identifier><identifier>EISSN: 1557-9972</identifier><identifier>DOI: 10.1109/TCAPT.2004.825763</identifier><identifier>CODEN: ITCPFB</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Conducting materials ; Construction ; Domain decomposition ; Finite difference methods ; Finite element methods ; Linear systems ; Linearity ; Matching ; Mathematical analysis ; Mathematical models ; Microwave photonics ; Networks ; Order reduction ; Packaging ; State-space methods ; Temperature dependence ; Thermal conductivity ; Thermal decomposition</subject><ispartof>IEEE transactions on components and packaging technologies, 2004-03, Vol.27 (1), p.87-95</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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As a result, from the analytical canonical forms of distributed linear thermal networks, reduced thermal networks are derived analytically. This direct construction of the reduced network, from the exact analytical solutions, avoids the inevitable inaccuracies inherent in conventional surface and volume meshing. It allows nearly exact reduced thermal network construction by domain decomposition for arbitrarily complicated structures.</description><subject>Conducting materials</subject><subject>Construction</subject><subject>Domain decomposition</subject><subject>Finite difference methods</subject><subject>Finite element methods</subject><subject>Linear systems</subject><subject>Linearity</subject><subject>Matching</subject><subject>Mathematical analysis</subject><subject>Mathematical models</subject><subject>Microwave photonics</subject><subject>Networks</subject><subject>Order reduction</subject><subject>Packaging</subject><subject>State-space methods</subject><subject>Temperature dependence</subject><subject>Thermal conductivity</subject><subject>Thermal decomposition</subject><issn>1521-3331</issn><issn>1557-9972</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqFkTtPwzAUhSMEEqXwAxBLxABTit-xx6riJVUqQ_bIiR3qksTFdoT673EIEhIDTOcO3zlX954kuYRgASEQd8Vq-VIsEABkwRHNGT5KZpDSPBMiR8fjjGCGMYanyZn3OwAg4UTMks2yl-0hmFq2aTe0weyt6UPa2U6PIkO9Nf1r6rQa6mBsn9omVcYHZ6ohaJWGrXZd9PY6fFj35s-Tk0a2Xl986zwpHu6L1VO23jw-r5brrMachIxKypkkueAcc1yxumI50FVDFMNCKcVBJasGa4ZyDBvNK0Upk5hTRWguKzxPbqfYvbPvg_ah7IyvddvKXtvBl1wwBBETeSRv_iSRIBBAwP4HOUFEABHB61_gzg4uvjGujdcgCgGIEJyg2lnvnW7KvTOddIcSgnJsrPxqrBwbK6fGoudq8hit9Q-PYioE-BN_1JKu</recordid><startdate>20040301</startdate><enddate>20040301</enddate><creator>Codecasa, L.</creator><creator>D'Amore, D.</creator><creator>Maffezzoni, P.</creator><creator>Batty, W.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Conducting materials Construction Domain decomposition Finite difference methods Finite element methods Linear systems Linearity Matching Mathematical analysis Mathematical models Microwave photonics Networks Order reduction Packaging State-space methods Temperature dependence Thermal conductivity Thermal decomposition |
| title | Analytical multipoint moment matching reduction of distributed thermal networks |
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