Numerical analysis of the process-induced stresses in silicon microstructures: application to micromachined cantilever

A technology computer aided design homemade tool, IMPACT, is described. The mechanical models and the numerical implementation are presented. Details are given about the methodology to calibrate and validate the implementation. This tool is used for the analysis of the processing of a micromachined...

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Veröffentlicht in:	Smart materials and structures 2006-02, Vol.15 (1), p.S47-S56
Hauptverfasser:	Senez, Vincent, Hoffmann, Thomas, Armigliato, Aldo, De Wolf, Ingrid
Format:	Artikel
Sprache:	eng
Schlagworte:	Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Mechanical and acoustical properties Physical properties of thin films, nonelectronic Physics Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
Online-Zugang:	Volltext
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