Numerical analysis of the process-induced stresses in silicon microstructures: application to micromachined cantilever

Numerical analysis of the process-induced stresses in silicon microstructures: application to micromachined cantilever

A technology computer aided design homemade tool, IMPACT, is described. The mechanical models and the numerical implementation are presented. Details are given about the methodology to calibrate and validate the implementation. This tool is used for the analysis of the processing of a micromachined...

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Veröffentlicht in:Smart materials and structures 2006-02, Vol.15 (1), p.S47-S56
Hauptverfasser: Senez, Vincent, Hoffmann, Thomas, Armigliato, Aldo, De Wolf, Ingrid
Format: Artikel
Sprache:eng
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Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Mechanical and acoustical properties
Physical properties of thin films, nonelectronic
Physics
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
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container_end_page S56
container_issue 1
container_start_page S47
container_title Smart materials and structures
container_volume 15
creator Senez, Vincent
Hoffmann, Thomas
Armigliato, Aldo
De Wolf, Ingrid
description A technology computer aided design homemade tool, IMPACT, is described. The mechanical models and the numerical implementation are presented. Details are given about the methodology to calibrate and validate the implementation. This tool is used for the analysis of the processing of a micromachined cantilever. The originality of the study lies in (i) the capability to simulate almost all the sources of stress taking into account the complex rheological behaviours of the materials, (ii) the experimental determination of the mechanical properties of various thin film materials, and (iii) the validation of the calculations by direct comparisons with the measured deformations of the cantilever.
doi_str_mv 10.1088/0964-1726/15/1/009
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source IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link
subjects Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Mechanical and acoustical properties
Physical properties of thin films, nonelectronic
Physics
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
title Numerical analysis of the process-induced stresses in silicon microstructures: application to micromachined cantilever
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