High conductivity of isotropic conductive adhesives filled with silver nanowires

As an alternative to lead-bearing solder, isotropic conductive adhesives (ICA) have been utilized for many years in microelectronic packaging. In this study, silver nitrate (AgNO 3) as precursor, N- N-dimethylformamide (DMF) as solvent and reducing agent, preparing silver (Ag) nanowires in the nanop...

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Veröffentlicht in:	International journal of adhesion and adhesives 2006-12, Vol.26 (8), p.617-621
Hauptverfasser:	Wu, H.P., Liu, J.F., Wu, X.J., Ge, M.Y., Wang, Y.W., Zhang, G.Q., Jiang, J.Z.
Format:	Artikel
Sprache:	eng
Schlagworte:	Application fields Applied sciences Composites Electronics Exact sciences and technology Mechanical properties of adhesives Microelectronic fabrication (materials and surfaces technology) Novel adhesives Polymer industry, paints, wood Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silver nanowires Technology of polymers
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