Correlation Between Bond Cleavage in Parylene N and the Degradation of Its Dielectric Properties

Parylene, a chemical vapor deposited polymer, is shown here to have limited stability when annealed and/or bias temperature stressed. Parylene N thin films were preannealed at 250, 300, and 350 deg C for 30 min and then bias temperature stressed at 150 deg C and 0.5 MV/cm for 0, 30, 60, and 90 min....

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Veröffentlicht in:	Electrochemical and solid-state letters 2004-01, Vol.7 (4), p.G56-G58
Hauptverfasser:	Senkevich, Jay J., Mallikarjunan, A., Wiegand, C. J., Lu, T.-M., Bani-Salameh, H. N., Lichti, R. L.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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