Microsolidics: Fabrication of Three-Dimensional Metallic Microstructures in Poly(dimethylsiloxane)

The fabrication of complex metallic microstructures in 3D by injecting liquid solder into microfluidic channels and allowing the solder to cool and solidify is demonstrated; after fabrication, the metallic structures can be flexed, bent, or twisted (see figure and cover). With this method it is poss...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Weinheim) 2007-03, Vol.19 (5), p.727-733
Hauptverfasser: Siegel, A. C., Bruzewicz, D. A., Weibel, D. B., Whitesides, G. M.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 733
container_issue 5
container_start_page 727
container_title Advanced materials (Weinheim)
container_volume 19
creator Siegel, A. C.
Bruzewicz, D. A.
Weibel, D. B.
Whitesides, G. M.
description The fabrication of complex metallic microstructures in 3D by injecting liquid solder into microfluidic channels and allowing the solder to cool and solidify is demonstrated; after fabrication, the metallic structures can be flexed, bent, or twisted (see figure and cover). With this method it is possible to build flexible electronic circuits, complex embedded or freestanding 3D metal microstructures, 3D electronic components, and hybrid electronic–microfluidic devices.
doi_str_mv 10.1002/adma.200601787
format Article
fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_29361553</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>29361553</sourcerecordid><originalsourceid>FETCH-LOGICAL-c4247-3d4c97de6fde6efdf909700bd68fa5deb94d069e9be2820c9bdf81b99eb30bf83</originalsourceid><addsrcrecordid>eNqFkElLBDEQRoMoOC5Xz30SPfRY6SXd8Ta4jKLjght4CVkqGM1Ma9KDzr-3hxbx5qEoKN4rqj5CdigMKUB2IM1UDjMABrSqqxUyoGVG0wJ4uUoGwPMy5ayo18lGjK8AwBmwAVETp0MTG--M0_EwOZUqOC1b18ySxib3LwExPXZTnMVuJH0ywVZ673TSi22Y63YeMCZultw0frFnOrh9WfjofPMlZ7i_Rdas9BG3f_omeTg9uT86Sy-vx-dHo8tUF1lRpbkpNK8MMtsVWmM58ApAGVZbWRpUvDDAOHKFWZ2B5srYmirOUeWgbJ1vkt1-73toPuYYWzF1UaP33RHNPIqM54yWZd6Bwx5cPhADWvEe3FSGhaAgllGKZZTiN8pO4L3w6Twu_qHF6Hgy-uumvetii1-_rgxvglV5VYqnq7G4ux0_XjzTWtT5N3Tbing</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>29361553</pqid></control><display><type>article</type><title>Microsolidics: Fabrication of Three-Dimensional Metallic Microstructures in Poly(dimethylsiloxane)</title><source>Wiley Online Library Journals Frontfile Complete</source><creator>Siegel, A. C. ; Bruzewicz, D. A. ; Weibel, D. B. ; Whitesides, G. M.</creator><creatorcontrib>Siegel, A. C. ; Bruzewicz, D. A. ; Weibel, D. B. ; Whitesides, G. M.</creatorcontrib><description>The fabrication of complex metallic microstructures in 3D by injecting liquid solder into microfluidic channels and allowing the solder to cool and solidify is demonstrated; after fabrication, the metallic structures can be flexed, bent, or twisted (see figure and cover). With this method it is possible to build flexible electronic circuits, complex embedded or freestanding 3D metal microstructures, 3D electronic components, and hybrid electronic–microfluidic devices.</description><identifier>ISSN: 0935-9648</identifier><identifier>EISSN: 1521-4095</identifier><identifier>DOI: 10.1002/adma.200601787</identifier><language>eng</language><publisher>Weinheim: WILEY-VCH Verlag</publisher><subject>Electronic microstructures ; Flexible electronics ; metal ; Microfluidic systems ; Microstructures ; Microstructures, metal ; Polydimethylsiloxane</subject><ispartof>Advanced materials (Weinheim), 2007-03, Vol.19 (5), p.727-733</ispartof><rights>Copyright © 2007 WILEY‐VCH Verlag GmbH &amp; Co. KGaA, Weinheim</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c4247-3d4c97de6fde6efdf909700bd68fa5deb94d069e9be2820c9bdf81b99eb30bf83</citedby><cites>FETCH-LOGICAL-c4247-3d4c97de6fde6efdf909700bd68fa5deb94d069e9be2820c9bdf81b99eb30bf83</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fadma.200601787$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,776,780,1411,27903,27904,45554</link.rule.ids></links><search><creatorcontrib>Siegel, A. C.</creatorcontrib><creatorcontrib>Bruzewicz, D. A.</creatorcontrib><creatorcontrib>Weibel, D. B.</creatorcontrib><creatorcontrib>Whitesides, G. M.</creatorcontrib><title>Microsolidics: Fabrication of Three-Dimensional Metallic Microstructures in Poly(dimethylsiloxane)</title><title>Advanced materials (Weinheim)</title><addtitle>Adv. Mater</addtitle><description>The fabrication of complex metallic microstructures in 3D by injecting liquid solder into microfluidic channels and allowing the solder to cool and solidify is demonstrated; after fabrication, the metallic structures can be flexed, bent, or twisted (see figure and cover). With this method it is possible to build flexible electronic circuits, complex embedded or freestanding 3D metal microstructures, 3D electronic components, and hybrid electronic–microfluidic devices.</description><subject>Electronic microstructures</subject><subject>Flexible electronics</subject><subject>metal</subject><subject>Microfluidic systems</subject><subject>Microstructures</subject><subject>Microstructures, metal</subject><subject>Polydimethylsiloxane</subject><issn>0935-9648</issn><issn>1521-4095</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><recordid>eNqFkElLBDEQRoMoOC5Xz30SPfRY6SXd8Ta4jKLjght4CVkqGM1Ma9KDzr-3hxbx5qEoKN4rqj5CdigMKUB2IM1UDjMABrSqqxUyoGVG0wJ4uUoGwPMy5ayo18lGjK8AwBmwAVETp0MTG--M0_EwOZUqOC1b18ySxib3LwExPXZTnMVuJH0ywVZ673TSi22Y63YeMCZultw0frFnOrh9WfjofPMlZ7i_Rdas9BG3f_omeTg9uT86Sy-vx-dHo8tUF1lRpbkpNK8MMtsVWmM58ApAGVZbWRpUvDDAOHKFWZ2B5srYmirOUeWgbJ1vkt1-73toPuYYWzF1UaP33RHNPIqM54yWZd6Bwx5cPhADWvEe3FSGhaAgllGKZZTiN8pO4L3w6Twu_qHF6Hgy-uumvetii1-_rgxvglV5VYqnq7G4ux0_XjzTWtT5N3Tbing</recordid><startdate>20070305</startdate><enddate>20070305</enddate><creator>Siegel, A. C.</creator><creator>Bruzewicz, D. A.</creator><creator>Weibel, D. B.</creator><creator>Whitesides, G. M.</creator><general>WILEY-VCH Verlag</general><general>WILEY‐VCH Verlag</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20070305</creationdate><title>Microsolidics: Fabrication of Three-Dimensional Metallic Microstructures in Poly(dimethylsiloxane)</title><author>Siegel, A. C. ; Bruzewicz, D. A. ; Weibel, D. B. ; Whitesides, G. M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c4247-3d4c97de6fde6efdf909700bd68fa5deb94d069e9be2820c9bdf81b99eb30bf83</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Electronic microstructures</topic><topic>Flexible electronics</topic><topic>metal</topic><topic>Microfluidic systems</topic><topic>Microstructures</topic><topic>Microstructures, metal</topic><topic>Polydimethylsiloxane</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Siegel, A. C.</creatorcontrib><creatorcontrib>Bruzewicz, D. A.</creatorcontrib><creatorcontrib>Weibel, D. B.</creatorcontrib><creatorcontrib>Whitesides, G. M.</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Advanced materials (Weinheim)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Siegel, A. C.</au><au>Bruzewicz, D. A.</au><au>Weibel, D. B.</au><au>Whitesides, G. M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Microsolidics: Fabrication of Three-Dimensional Metallic Microstructures in Poly(dimethylsiloxane)</atitle><jtitle>Advanced materials (Weinheim)</jtitle><addtitle>Adv. Mater</addtitle><date>2007-03-05</date><risdate>2007</risdate><volume>19</volume><issue>5</issue><spage>727</spage><epage>733</epage><pages>727-733</pages><issn>0935-9648</issn><eissn>1521-4095</eissn><abstract>The fabrication of complex metallic microstructures in 3D by injecting liquid solder into microfluidic channels and allowing the solder to cool and solidify is demonstrated; after fabrication, the metallic structures can be flexed, bent, or twisted (see figure and cover). With this method it is possible to build flexible electronic circuits, complex embedded or freestanding 3D metal microstructures, 3D electronic components, and hybrid electronic–microfluidic devices.</abstract><cop>Weinheim</cop><pub>WILEY-VCH Verlag</pub><doi>10.1002/adma.200601787</doi><tpages>7</tpages></addata></record>
fulltext fulltext
identifier ISSN: 0935-9648
ispartof Advanced materials (Weinheim), 2007-03, Vol.19 (5), p.727-733
issn 0935-9648
1521-4095
language eng
recordid cdi_proquest_miscellaneous_29361553
source Wiley Online Library Journals Frontfile Complete
subjects Electronic microstructures
Flexible electronics
metal
Microfluidic systems
Microstructures
Microstructures, metal
Polydimethylsiloxane
title Microsolidics: Fabrication of Three-Dimensional Metallic Microstructures in Poly(dimethylsiloxane)
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T23%3A50%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Microsolidics:%20Fabrication%20of%20Three-Dimensional%20Metallic%20Microstructures%20in%20Poly(dimethylsiloxane)&rft.jtitle=Advanced%20materials%20(Weinheim)&rft.au=Siegel,%20A.%E2%80%89C.&rft.date=2007-03-05&rft.volume=19&rft.issue=5&rft.spage=727&rft.epage=733&rft.pages=727-733&rft.issn=0935-9648&rft.eissn=1521-4095&rft_id=info:doi/10.1002/adma.200601787&rft_dat=%3Cproquest_cross%3E29361553%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=29361553&rft_id=info:pmid/&rfr_iscdi=true