A versatile approach to selective and inexpensive copper patterns using polyelectrolyte multilayer coatings

Versatile, highly selective, and inexpensive metal patterning techniques on various substrates are demanded for current research in microelectronic device fabrications. We present a new process for creating highly selective and cost-effective copper patterns that can be plated on virtually any subst...

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Veröffentlicht in:	Thin solid films 2006-12, Vol.515 (4), p.2347-2352
Hauptverfasser:	Hendricks, Troy R., Lee, Ilsoon
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Catalysis Catalysts: preparations and properties Chemistry Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology General and physical chemistry Integrated circuits Metallization Microcontact printing Microelectronic fabrication (materials and surfaces technology) Multilayers Polyelectrolyte Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Theory of reactions, general kinetics. Catalysis. Nomenclature, chemical documentation, computer chemistry
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