Local thermal property analysis by scanning thermal microscopy of an ultrafine-grained copper surface layer produced by surface mechanical attrition treatment

Scanning thermal microscopy (SThM) was used to map thermal conductivity images in an ultrafine-grained copper surface layer produced by surface mechanical attrition treatment (SMAT). It is found that the deformed surface layer shows different thermal conductivities that strongly depend on the grain...

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Veröffentlicht in:	Materials science & engineering. B, Solid-state materials for advanced technology Solid-state materials for advanced technology, 2006-06, Vol.130 (1), p.24-30
Hauptverfasser:	Guo, F.A., JI, Y.L., Trannoy, N., Lu, J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Copper SMAT SThM Thermal conductivity Ultrafine-grained microstructure
Online-Zugang:	Volltext
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