High-quality cutting of polished single-crystal silicon by wire electrical discharge machining

We discussed a method for cutting smoothly polished single-crystal silicon surfaces by wire electrical discharge machining to obtain a high-quality surface. To cut out parts with smooth surfaces from the plates by rough-cutting in water while maintaining the initial smoothness of the surfaces, sever...

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Veröffentlicht in:Precision engineering 2005-10, Vol.29 (4), p.423-430
Hauptverfasser: Takino, Hideo, Ichinohe, Toshimitsu, Tanimoto, Katsunori, Yamaguchi, Syuichi, Nomura, Kazushi, Kunieda, Masanori
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container_end_page 430
container_issue 4
container_start_page 423
container_title Precision engineering
container_volume 29
creator Takino, Hideo
Ichinohe, Toshimitsu
Tanimoto, Katsunori
Yamaguchi, Syuichi
Nomura, Kazushi
Kunieda, Masanori
description We discussed a method for cutting smoothly polished single-crystal silicon surfaces by wire electrical discharge machining to obtain a high-quality surface. To cut out parts with smooth surfaces from the plates by rough-cutting in water while maintaining the initial smoothness of the surfaces, several kinds of masks were applied to the polished surfaces before cutting. It was found that although the application of resin masks is effective for obtaining smooth surfaces far from the cut section, the surface smoothness near the section cut in water is less than in the case of cutting in oil. Next, finish-cutting in oil was performed to remove cracks and chips generated by rough-cutting in oil. As a result, although a few chips were generated at edges of the cut section, cracks were successfully removed by finish-cutting, so that the surface quality was successfully improved by finish-cutting in oil.
doi_str_mv 10.1016/j.precisioneng.2004.12.004
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fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_29283510</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0141635905000115</els_id><sourcerecordid>29283510</sourcerecordid><originalsourceid>FETCH-LOGICAL-c385t-27b196b53b2313883c8eaa7f52116b4436abc980defa7a0691592444b5cd68173</originalsourceid><addsrcrecordid>eNqNUMtOwzAQtBBIlMI_REhwS_DaeTjcUHkUqRIXuGI5ziZx5SatnYL697hqJThyGu3u7M7OEHINNAEK-d0yWTvUxpuhx75NGKVpAiwJcEImIAoeM16wUzKhkEKc86w8JxfeLymlhaDphHzOTdvFm62yZtxFejuOpm-joYnWgzW-wzryoWEx1m7nR2VDaY0e-qjaRd_GYYQW9eiMDqPaeN0p12K0UrozfVi8JGeNsh6vjjglH89P77N5vHh7eZ09LGLNRTbGrKigzKuMV4wDF4JrgUoVTcYA8ipNea4qXQpaY6MKRfMSspKlaVplus4FFHxKbg93127YbNGPchWeQWtVj8PWS1YywTOggXh_IGo3eO-wkWtnVsrtJFC5j1Qu5d9I5T5SCUwGCMs3RxXlg-HGqT4Qfy8UwEsWhKbk8cDDYPnLoJNeG-w11iExPcp6MP-R-wHPyJSk</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>29283510</pqid></control><display><type>article</type><title>High-quality cutting of polished single-crystal silicon by wire electrical discharge machining</title><source>ScienceDirect Journals (5 years ago - present)</source><creator>Takino, Hideo ; Ichinohe, Toshimitsu ; Tanimoto, Katsunori ; Yamaguchi, Syuichi ; Nomura, Kazushi ; Kunieda, Masanori</creator><creatorcontrib>Takino, Hideo ; Ichinohe, Toshimitsu ; Tanimoto, Katsunori ; Yamaguchi, Syuichi ; Nomura, Kazushi ; Kunieda, Masanori</creatorcontrib><description>We discussed a method for cutting smoothly polished single-crystal silicon surfaces by wire electrical discharge machining to obtain a high-quality surface. To cut out parts with smooth surfaces from the plates by rough-cutting in water while maintaining the initial smoothness of the surfaces, several kinds of masks were applied to the polished surfaces before cutting. It was found that although the application of resin masks is effective for obtaining smooth surfaces far from the cut section, the surface smoothness near the section cut in water is less than in the case of cutting in oil. Next, finish-cutting in oil was performed to remove cracks and chips generated by rough-cutting in oil. As a result, although a few chips were generated at edges of the cut section, cracks were successfully removed by finish-cutting, so that the surface quality was successfully improved by finish-cutting in oil.</description><identifier>ISSN: 0141-6359</identifier><identifier>EISSN: 1873-2372</identifier><identifier>DOI: 10.1016/j.precisioneng.2004.12.004</identifier><identifier>CODEN: PREGDL</identifier><language>eng</language><publisher>New York, NY: Elsevier Inc</publisher><subject>Applied sciences ; Cut ; Exact sciences and technology ; Mechanical engineering. Machine design ; Mirror ; Optics ; Precision engineering, watch making ; Roughness ; Silicon ; Surface ; Wire electrical discharge machining (WEDM)</subject><ispartof>Precision engineering, 2005-10, Vol.29 (4), p.423-430</ispartof><rights>2005 Elsevier Inc.</rights><rights>2005 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c385t-27b196b53b2313883c8eaa7f52116b4436abc980defa7a0691592444b5cd68173</citedby><cites>FETCH-LOGICAL-c385t-27b196b53b2313883c8eaa7f52116b4436abc980defa7a0691592444b5cd68173</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.precisioneng.2004.12.004$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&amp;idt=17139228$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Takino, Hideo</creatorcontrib><creatorcontrib>Ichinohe, Toshimitsu</creatorcontrib><creatorcontrib>Tanimoto, Katsunori</creatorcontrib><creatorcontrib>Yamaguchi, Syuichi</creatorcontrib><creatorcontrib>Nomura, Kazushi</creatorcontrib><creatorcontrib>Kunieda, Masanori</creatorcontrib><title>High-quality cutting of polished single-crystal silicon by wire electrical discharge machining</title><title>Precision engineering</title><description>We discussed a method for cutting smoothly polished single-crystal silicon surfaces by wire electrical discharge machining to obtain a high-quality surface. To cut out parts with smooth surfaces from the plates by rough-cutting in water while maintaining the initial smoothness of the surfaces, several kinds of masks were applied to the polished surfaces before cutting. It was found that although the application of resin masks is effective for obtaining smooth surfaces far from the cut section, the surface smoothness near the section cut in water is less than in the case of cutting in oil. Next, finish-cutting in oil was performed to remove cracks and chips generated by rough-cutting in oil. As a result, although a few chips were generated at edges of the cut section, cracks were successfully removed by finish-cutting, so that the surface quality was successfully improved by finish-cutting in oil.</description><subject>Applied sciences</subject><subject>Cut</subject><subject>Exact sciences and technology</subject><subject>Mechanical engineering. Machine design</subject><subject>Mirror</subject><subject>Optics</subject><subject>Precision engineering, watch making</subject><subject>Roughness</subject><subject>Silicon</subject><subject>Surface</subject><subject>Wire electrical discharge machining (WEDM)</subject><issn>0141-6359</issn><issn>1873-2372</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><recordid>eNqNUMtOwzAQtBBIlMI_REhwS_DaeTjcUHkUqRIXuGI5ziZx5SatnYL697hqJThyGu3u7M7OEHINNAEK-d0yWTvUxpuhx75NGKVpAiwJcEImIAoeM16wUzKhkEKc86w8JxfeLymlhaDphHzOTdvFm62yZtxFejuOpm-joYnWgzW-wzryoWEx1m7nR2VDaY0e-qjaRd_GYYQW9eiMDqPaeN0p12K0UrozfVi8JGeNsh6vjjglH89P77N5vHh7eZ09LGLNRTbGrKigzKuMV4wDF4JrgUoVTcYA8ipNea4qXQpaY6MKRfMSspKlaVplus4FFHxKbg93127YbNGPchWeQWtVj8PWS1YywTOggXh_IGo3eO-wkWtnVsrtJFC5j1Qu5d9I5T5SCUwGCMs3RxXlg-HGqT4Qfy8UwEsWhKbk8cDDYPnLoJNeG-w11iExPcp6MP-R-wHPyJSk</recordid><startdate>20051001</startdate><enddate>20051001</enddate><creator>Takino, Hideo</creator><creator>Ichinohe, Toshimitsu</creator><creator>Tanimoto, Katsunori</creator><creator>Yamaguchi, Syuichi</creator><creator>Nomura, Kazushi</creator><creator>Kunieda, Masanori</creator><general>Elsevier Inc</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7TB</scope><scope>8FD</scope><scope>FR3</scope></search><sort><creationdate>20051001</creationdate><title>High-quality cutting of polished single-crystal silicon by wire electrical discharge machining</title><author>Takino, Hideo ; Ichinohe, Toshimitsu ; Tanimoto, Katsunori ; Yamaguchi, Syuichi ; Nomura, Kazushi ; Kunieda, Masanori</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c385t-27b196b53b2313883c8eaa7f52116b4436abc980defa7a0691592444b5cd68173</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Applied sciences</topic><topic>Cut</topic><topic>Exact sciences and technology</topic><topic>Mechanical engineering. Machine design</topic><topic>Mirror</topic><topic>Optics</topic><topic>Precision engineering, watch making</topic><topic>Roughness</topic><topic>Silicon</topic><topic>Surface</topic><topic>Wire electrical discharge machining (WEDM)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Takino, Hideo</creatorcontrib><creatorcontrib>Ichinohe, Toshimitsu</creatorcontrib><creatorcontrib>Tanimoto, Katsunori</creatorcontrib><creatorcontrib>Yamaguchi, Syuichi</creatorcontrib><creatorcontrib>Nomura, Kazushi</creatorcontrib><creatorcontrib>Kunieda, Masanori</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Mechanical &amp; Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><jtitle>Precision engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Takino, Hideo</au><au>Ichinohe, Toshimitsu</au><au>Tanimoto, Katsunori</au><au>Yamaguchi, Syuichi</au><au>Nomura, Kazushi</au><au>Kunieda, Masanori</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>High-quality cutting of polished single-crystal silicon by wire electrical discharge machining</atitle><jtitle>Precision engineering</jtitle><date>2005-10-01</date><risdate>2005</risdate><volume>29</volume><issue>4</issue><spage>423</spage><epage>430</epage><pages>423-430</pages><issn>0141-6359</issn><eissn>1873-2372</eissn><coden>PREGDL</coden><abstract>We discussed a method for cutting smoothly polished single-crystal silicon surfaces by wire electrical discharge machining to obtain a high-quality surface. To cut out parts with smooth surfaces from the plates by rough-cutting in water while maintaining the initial smoothness of the surfaces, several kinds of masks were applied to the polished surfaces before cutting. It was found that although the application of resin masks is effective for obtaining smooth surfaces far from the cut section, the surface smoothness near the section cut in water is less than in the case of cutting in oil. Next, finish-cutting in oil was performed to remove cracks and chips generated by rough-cutting in oil. As a result, although a few chips were generated at edges of the cut section, cracks were successfully removed by finish-cutting, so that the surface quality was successfully improved by finish-cutting in oil.</abstract><cop>New York, NY</cop><pub>Elsevier Inc</pub><doi>10.1016/j.precisioneng.2004.12.004</doi><tpages>8</tpages></addata></record>
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source ScienceDirect Journals (5 years ago - present)
subjects Applied sciences
Cut
Exact sciences and technology
Mechanical engineering. Machine design
Mirror
Optics
Precision engineering, watch making
Roughness
Silicon
Surface
Wire electrical discharge machining (WEDM)
title High-quality cutting of polished single-crystal silicon by wire electrical discharge machining
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T02%3A29%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=High-quality%20cutting%20of%20polished%20single-crystal%20silicon%20by%20wire%20electrical%20discharge%20machining&rft.jtitle=Precision%20engineering&rft.au=Takino,%20Hideo&rft.date=2005-10-01&rft.volume=29&rft.issue=4&rft.spage=423&rft.epage=430&rft.pages=423-430&rft.issn=0141-6359&rft.eissn=1873-2372&rft.coden=PREGDL&rft_id=info:doi/10.1016/j.precisioneng.2004.12.004&rft_dat=%3Cproquest_cross%3E29283510%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=29283510&rft_id=info:pmid/&rft_els_id=S0141635905000115&rfr_iscdi=true