Formation and growth kinetics of interfacial intermetallics in Pb-free solder joint

The formation and growth kinetics of the intermetallic compound (IMC) between lead-free solder and Cu substrate in the surface mount process were studied. Optical and scanning electron microscope (OM and SEM) were used to measure the thickness of intermetallic layers and observe the microstructure e...

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Veröffentlicht in:	IEEE transactions on components and packaging technologies 2003-09, Vol.26 (3), p.651-658
Hauptverfasser:	Li, G.Y., Chen, B.L.
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Diffusion layers Electron optics Environmentally friendly manufacturing techniques Grain size Intermetallic Intermetallic compounds Intermetallics Kinetic theory Law Lead compounds Mathematical models Optical microscopy Scanning electron microscopy Soldering Solders Thickness measurement Tin X-rays
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