Faraday in the Fab: A Look at Copper Plating Equipment for On-Chip Wiring
It has been interesting to watch the growth and development of copper interconnects on silicon chips in the seven years that have passed since IBM announced that it would use electrodeposited copper for the wiring structure of its 0.25-micrometer CMOS7 microprocessor.
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| Veröffentlicht in: | The Electrochemical Society interface 2004-12, Vol.13 (4), p.40-44 |
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| container_end_page | 44 |
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| container_title | The Electrochemical Society interface |
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| creator | Beaudry, Christopher L Dukovic, John O |
| description | It has been interesting to watch the growth and development of copper interconnects on silicon chips in the seven years that have passed since IBM announced that it would use electrodeposited copper for the wiring structure of its 0.25-micrometer CMOS7 microprocessor. |
| doi_str_mv | 10.1149/2.F06044IF |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_29254547</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2622621627</sourcerecordid><originalsourceid>FETCH-LOGICAL-c205t-73b074d11402162b3f3141a88ab9bcfd2752d08df25bc039a3dcda5a0c0222163</originalsourceid><addsrcrecordid>eNpdkE9Lw0AQxRdRsFYvfoIFwYOQOju7-eethEYLhXpQPC6bZGNT02y6mxz67bulehEG5sH8ZubxCLlnMGNMpM84yyECIZb5BZmwVIggiRN-6TVEXiMk1-TGuS0AE5DihCxzZVWlDrTp6LDRNFfFC53TlTE_VA00M32vLX1v1dB033SxH5t-p7uB1sbSdRdkm6anX431w1tyVavW6bvfPiWf-eIjewtW69dlNl8FJUI4BDEvIBaVdwvIIix4zZlgKklUkRZlXWEcYgVJVWNYlMBTxauyUqGCEhD9Bp-Sx_Pd3pr9qN0gd40rdduqTpvRSUwxFKGIPfjwD9ya0Xbem8QIffn3J-rpTJXWOGd1LXvb7JQ9SAbylKlE-ZcpPwIsGWW2</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2622621627</pqid></control><display><type>article</type><title>Faraday in the Fab: A Look at Copper Plating Equipment for On-Chip Wiring</title><source>EZB Electronic Journals Library</source><creator>Beaudry, Christopher L ; Dukovic, John O</creator><creatorcontrib>Beaudry, Christopher L ; Dukovic, John O</creatorcontrib><description>It has been interesting to watch the growth and development of copper interconnects on silicon chips in the seven years that have passed since IBM announced that it would use electrodeposited copper for the wiring structure of its 0.25-micrometer CMOS7 microprocessor.</description><identifier>ISSN: 1064-8208</identifier><identifier>EISSN: 1944-8783</identifier><identifier>DOI: 10.1149/2.F06044IF</identifier><language>eng</language><publisher>Pennington: IOP Publishing</publisher><subject>Copper ; Copper plating ; Wiring</subject><ispartof>The Electrochemical Society interface, 2004-12, Vol.13 (4), p.40-44</ispartof><rights>Copyright IOP Publishing Dec 2004</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c205t-73b074d11402162b3f3141a88ab9bcfd2752d08df25bc039a3dcda5a0c0222163</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27903,27904</link.rule.ids></links><search><creatorcontrib>Beaudry, Christopher L</creatorcontrib><creatorcontrib>Dukovic, John O</creatorcontrib><title>Faraday in the Fab: A Look at Copper Plating Equipment for On-Chip Wiring</title><title>The Electrochemical Society interface</title><description>It has been interesting to watch the growth and development of copper interconnects on silicon chips in the seven years that have passed since IBM announced that it would use electrodeposited copper for the wiring structure of its 0.25-micrometer CMOS7 microprocessor.</description><subject>Copper</subject><subject>Copper plating</subject><subject>Wiring</subject><issn>1064-8208</issn><issn>1944-8783</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><recordid>eNpdkE9Lw0AQxRdRsFYvfoIFwYOQOju7-eethEYLhXpQPC6bZGNT02y6mxz67bulehEG5sH8ZubxCLlnMGNMpM84yyECIZb5BZmwVIggiRN-6TVEXiMk1-TGuS0AE5DihCxzZVWlDrTp6LDRNFfFC53TlTE_VA00M32vLX1v1dB033SxH5t-p7uB1sbSdRdkm6anX431w1tyVavW6bvfPiWf-eIjewtW69dlNl8FJUI4BDEvIBaVdwvIIix4zZlgKklUkRZlXWEcYgVJVWNYlMBTxauyUqGCEhD9Bp-Sx_Pd3pr9qN0gd40rdduqTpvRSUwxFKGIPfjwD9ya0Xbem8QIffn3J-rpTJXWOGd1LXvb7JQ9SAbylKlE-ZcpPwIsGWW2</recordid><startdate>200412</startdate><enddate>200412</enddate><creator>Beaudry, Christopher L</creator><creator>Dukovic, John O</creator><general>IOP Publishing</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>200412</creationdate><title>Faraday in the Fab: A Look at Copper Plating Equipment for On-Chip Wiring</title><author>Beaudry, Christopher L ; Dukovic, John O</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c205t-73b074d11402162b3f3141a88ab9bcfd2752d08df25bc039a3dcda5a0c0222163</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Copper</topic><topic>Copper plating</topic><topic>Wiring</topic><toplevel>online_resources</toplevel><creatorcontrib>Beaudry, Christopher L</creatorcontrib><creatorcontrib>Dukovic, John O</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>The Electrochemical Society interface</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Beaudry, Christopher L</au><au>Dukovic, John O</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Faraday in the Fab: A Look at Copper Plating Equipment for On-Chip Wiring</atitle><jtitle>The Electrochemical Society interface</jtitle><date>2004-12</date><risdate>2004</risdate><volume>13</volume><issue>4</issue><spage>40</spage><epage>44</epage><pages>40-44</pages><issn>1064-8208</issn><eissn>1944-8783</eissn><abstract>It has been interesting to watch the growth and development of copper interconnects on silicon chips in the seven years that have passed since IBM announced that it would use electrodeposited copper for the wiring structure of its 0.25-micrometer CMOS7 microprocessor.</abstract><cop>Pennington</cop><pub>IOP Publishing</pub><doi>10.1149/2.F06044IF</doi><tpages>5</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 1064-8208 |
| ispartof | The Electrochemical Society interface, 2004-12, Vol.13 (4), p.40-44 |
| issn | 1064-8208 1944-8783 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_29254547 |
| source | EZB Electronic Journals Library |
| subjects | Copper Copper plating Wiring |
| title | Faraday in the Fab: A Look at Copper Plating Equipment for On-Chip Wiring |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T20%3A29%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Faraday%20in%20the%20Fab:%20A%20Look%20at%20Copper%20Plating%20Equipment%20for%20On-Chip%20Wiring&rft.jtitle=The%20Electrochemical%20Society%20interface&rft.au=Beaudry,%20Christopher%20L&rft.date=2004-12&rft.volume=13&rft.issue=4&rft.spage=40&rft.epage=44&rft.pages=40-44&rft.issn=1064-8208&rft.eissn=1944-8783&rft_id=info:doi/10.1149/2.F06044IF&rft_dat=%3Cproquest_cross%3E2622621627%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2622621627&rft_id=info:pmid/&rfr_iscdi=true |