Faraday in the Fab: A Look at Copper Plating Equipment for On-Chip Wiring

Faraday in the Fab: A Look at Copper Plating Equipment for On-Chip Wiring

It has been interesting to watch the growth and development of copper interconnects on silicon chips in the seven years that have passed since IBM announced that it would use electrodeposited copper for the wiring structure of its 0.25-micrometer CMOS7 microprocessor.

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Veröffentlicht in:The Electrochemical Society interface 2004-12, Vol.13 (4), p.40-44
Hauptverfasser: Beaudry, Christopher L, Dukovic, John O
Format: Artikel
Sprache:eng
Schlagworte:
Copper
Copper plating
Wiring
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Zusammenfassung:It has been interesting to watch the growth and development of copper interconnects on silicon chips in the seven years that have passed since IBM announced that it would use electrodeposited copper for the wiring structure of its 0.25-micrometer CMOS7 microprocessor.
ISSN:1064-8208
1944-8783
DOI:10.1149/2.F06044IF