Fracture characterization in patterned thin films by cross-sectional nanoindentation
A testing technique based on cross-sectional nanoindentation has been used to assess the mechanical reliability of interconnect structures. A Berkovich indenter was used to initiate fracture in a silicon substrate and cracks propagated through the structure. To better control crack growth and to con...
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| Veröffentlicht in: | Acta materialia 2006-08, Vol.54 (13), p.3453-3462 |
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| creator | Ocaña, I. Molina-Aldareguia, J.M. Gonzalez, D. Elizalde, M.R. Sánchez, J.M. Martínez-Esnaola, J.M. Gil Sevillano, J. Scherban, T. Pantuso, D. Sun, B. Xu, G. Miner, B. He, J. Maiz, J. |
| description | A testing technique based on cross-sectional nanoindentation has been used to assess the mechanical reliability of interconnect structures. A Berkovich indenter was used to initiate fracture in a silicon substrate and cracks propagated through the structure. To better control crack growth and to convert the problem into two dimensions, a trench parallel to the indentation surface was previously machined using a focused ion beam. The crack lengths obtained for different material systems in the interconnect structure correlate well with the fracture energies measured for the same materials in blanket films. Finite element model simulations incorporating cohesive elements have been used to model the fracture processes and to explain the different cracking behaviour observed. |
| doi_str_mv | 10.1016/j.actamat.2006.03.027 |
| format | Article |
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A Berkovich indenter was used to initiate fracture in a silicon substrate and cracks propagated through the structure. To better control crack growth and to convert the problem into two dimensions, a trench parallel to the indentation surface was previously machined using a focused ion beam. The crack lengths obtained for different material systems in the interconnect structure correlate well with the fracture energies measured for the same materials in blanket films. Finite element model simulations incorporating cohesive elements have been used to model the fracture processes and to explain the different cracking behaviour observed.</description><identifier>ISSN: 1359-6454</identifier><identifier>EISSN: 1873-2453</identifier><identifier>DOI: 10.1016/j.actamat.2006.03.027</identifier><language>eng</language><publisher>Oxford: Elsevier Ltd</publisher><subject>Applied sciences ; Cohesive model ; Computer simulation ; Crack initiation ; Crack propagation ; Cross sections ; Exact sciences and technology ; Fracture ; Fracture mechanics ; Fractures ; Indenters ; Interfaces ; Mathematical models ; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology ; Metals. Metallurgy ; Nanoindentation ; Thin films</subject><ispartof>Acta materialia, 2006-08, Vol.54 (13), p.3453-3462</ispartof><rights>2006 Acta Materialia Inc.</rights><rights>2007 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c403t-ab105b673466e43414c5bcca500b9fd98ffe338ab10e1e58f7cd0f42ee6935973</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S1359645406002370$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>309,310,314,776,780,785,786,3537,23909,23910,25118,27901,27902,65306</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=17977024$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Ocaña, I.</creatorcontrib><creatorcontrib>Molina-Aldareguia, J.M.</creatorcontrib><creatorcontrib>Gonzalez, D.</creatorcontrib><creatorcontrib>Elizalde, M.R.</creatorcontrib><creatorcontrib>Sánchez, J.M.</creatorcontrib><creatorcontrib>Martínez-Esnaola, J.M.</creatorcontrib><creatorcontrib>Gil Sevillano, J.</creatorcontrib><creatorcontrib>Scherban, T.</creatorcontrib><creatorcontrib>Pantuso, D.</creatorcontrib><creatorcontrib>Sun, B.</creatorcontrib><creatorcontrib>Xu, G.</creatorcontrib><creatorcontrib>Miner, B.</creatorcontrib><creatorcontrib>He, J.</creatorcontrib><creatorcontrib>Maiz, J.</creatorcontrib><title>Fracture characterization in patterned thin films by cross-sectional nanoindentation</title><title>Acta materialia</title><description>A testing technique based on cross-sectional nanoindentation has been used to assess the mechanical reliability of interconnect structures. A Berkovich indenter was used to initiate fracture in a silicon substrate and cracks propagated through the structure. To better control crack growth and to convert the problem into two dimensions, a trench parallel to the indentation surface was previously machined using a focused ion beam. The crack lengths obtained for different material systems in the interconnect structure correlate well with the fracture energies measured for the same materials in blanket films. Finite element model simulations incorporating cohesive elements have been used to model the fracture processes and to explain the different cracking behaviour observed.</description><subject>Applied sciences</subject><subject>Cohesive model</subject><subject>Computer simulation</subject><subject>Crack initiation</subject><subject>Crack propagation</subject><subject>Cross sections</subject><subject>Exact sciences and technology</subject><subject>Fracture</subject><subject>Fracture mechanics</subject><subject>Fractures</subject><subject>Indenters</subject><subject>Interfaces</subject><subject>Mathematical models</subject><subject>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</subject><subject>Metals. 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A Berkovich indenter was used to initiate fracture in a silicon substrate and cracks propagated through the structure. To better control crack growth and to convert the problem into two dimensions, a trench parallel to the indentation surface was previously machined using a focused ion beam. The crack lengths obtained for different material systems in the interconnect structure correlate well with the fracture energies measured for the same materials in blanket films. Finite element model simulations incorporating cohesive elements have been used to model the fracture processes and to explain the different cracking behaviour observed.</abstract><cop>Oxford</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.actamat.2006.03.027</doi><tpages>10</tpages></addata></record> |
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| subjects | Applied sciences Cohesive model Computer simulation Crack initiation Crack propagation Cross sections Exact sciences and technology Fracture Fracture mechanics Fractures Indenters Interfaces Mathematical models Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals. Metallurgy Nanoindentation Thin films |
| title | Fracture characterization in patterned thin films by cross-sectional nanoindentation |
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