Adhesion studies of diamond-like carbon films deposited on Ti6Al4V substrate with a silicon interlayer

Diamond-like carbon (DLC) films have proven quite advantageous in many tribological applications due to their low friction coefficient, their extreme hardness, and more recently their high adherence on different substrate materials. However, for many applications, DLC films as thick as 2 μm are requ...

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Veröffentlicht in:Thin solid films 2006-09, Vol.515 (1), p.375-379
Hauptverfasser: Bonetti, L.F., Capote, G., Santos, L.V., Corat, E.J., Trava-Airoldi, V.J.
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container_end_page 379
container_issue 1
container_start_page 375
container_title Thin solid films
container_volume 515
creator Bonetti, L.F.
Capote, G.
Santos, L.V.
Corat, E.J.
Trava-Airoldi, V.J.
description Diamond-like carbon (DLC) films have proven quite advantageous in many tribological applications due to their low friction coefficient, their extreme hardness, and more recently their high adherence on different substrate materials. However, for many applications, DLC films as thick as 2 μm are required, which cause high residual stress. In order to overcome this problem, this study observed the behavior of different thicknesses of silicon interlayer between DLC films and Ti6Al4V substrates. The study also analyzed the relation of growth parameters to the mechanical properties of DLC films. Silicon and DLC films were grown by using a rf-PECVD at 13.56 MHz with silane and methane atmospheres, respectively. The contribution of an interlayer thickness to the adhesion between the DLC films and Ti6Al4V substrate was evaluated by using a micro-scratch technique. The hardness and friction coefficient were evaluated by using microindentation and lateral force microscopy (LFM), respectively. Raman scattering spectroscopy was used to characterize the film quality. A correlation was found between the intrinsic stress and adhesion of DLC film and the parameters of the silicon interlayer growth. The addition of a silicon interlayer successfully reduced intrinsic stress of the films, even as measured by using a perfilometry technique.
doi_str_mv 10.1016/j.tsf.2005.12.154
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subjects Adhesion
Anelasticity, internal friction, stress relaxation, and mechanical resonances
Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)
Condensed matter: structure, mechanical and thermal properties
Cross-disciplinary physics: materials science
rheology
Diamond-like carbon (DLC)
Exact sciences and technology
Materials science
Mechanical and acoustical properties of condensed matter
Mechanical and acoustical properties
adhesion
Mechanical properties of solids
Methods of deposition of films and coatings
film growth and epitaxy
PECVD
Physics
Silicon interlayer
Solid surfaces and solid-solid interfaces
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Tribology and hardness
title Adhesion studies of diamond-like carbon films deposited on Ti6Al4V substrate with a silicon interlayer
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