Synthesis and manufacture of polyamide-imide/copper foil laminates without adhesive
Three kinds of polyamide-imide (PAI) were synthesized. The polyimide prepolymer was synthesized from 4,4'-diphenylmethane diisocyanate (MDI) and 3,3'-4,4'-benzophenone tetracarboxylic dianhydride (BTDA), after which the prepolymer was reacted respectively with terephthalic acid (TPA),...
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| Veröffentlicht in: | Polymers & polymer composites 2006, Vol.14 (1), p.89-105 |
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| creator | HUANG, Meng-Shun YANG, Ming-Chien SHEN CHOU |
| description | Three kinds of polyamide-imide (PAI) were synthesized. The polyimide prepolymer was synthesized from 4,4'-diphenylmethane diisocyanate (MDI) and 3,3'-4,4'-benzophenone tetracarboxylic dianhydride (BTDA), after which the prepolymer was reacted respectively with terephthalic acid (TPA), isophthalic acid (IPA), and 4,4'-oxybisbenzonic acid (OBBA) to form PAI-1, PAI-2, and PAI-3. Their chemical structures were characterized using elemental analyses (EA), Fourier transform infrared spectrometry (FTIR), and nuclear magnetic resonance (NMR). The thermal properties, electrical properties, solubility, and mechanical properties of these PAIs, and the peel strength retention and electrical properties of PAI/Cu laminates were measured. The dielectric constants of PAI laminates were lower than 5.5 and the dissipation factors were lower than 0.035, and were in the order of PAI-3 < PAI-1 < PAI-2. These PAI/Cu laminates exhibited peel strength higher than 2.30 kN/m under normal circumstances and higher than 2.15 kN/m after heating. The order of peel strength was PAI-1 > PAI-3 > PAI-2. |
| doi_str_mv | 10.1177/096739110601400109 |
| format | Article |
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The polyimide prepolymer was synthesized from 4,4'-diphenylmethane diisocyanate (MDI) and 3,3'-4,4'-benzophenone tetracarboxylic dianhydride (BTDA), after which the prepolymer was reacted respectively with terephthalic acid (TPA), isophthalic acid (IPA), and 4,4'-oxybisbenzonic acid (OBBA) to form PAI-1, PAI-2, and PAI-3. Their chemical structures were characterized using elemental analyses (EA), Fourier transform infrared spectrometry (FTIR), and nuclear magnetic resonance (NMR). The thermal properties, electrical properties, solubility, and mechanical properties of these PAIs, and the peel strength retention and electrical properties of PAI/Cu laminates were measured. The dielectric constants of PAI laminates were lower than 5.5 and the dissipation factors were lower than 0.035, and were in the order of PAI-3 < PAI-1 < PAI-2. These PAI/Cu laminates exhibited peel strength higher than 2.30 kN/m under normal circumstances and higher than 2.15 kN/m after heating. The order of peel strength was PAI-1 > PAI-3 > PAI-2.</description><identifier>ISSN: 0967-3911</identifier><identifier>EISSN: 1478-2391</identifier><identifier>DOI: 10.1177/096739110601400109</identifier><language>eng</language><publisher>Shrewsbury: Rapra Technology</publisher><subject>Applied sciences ; Exact sciences and technology ; Forms of application and semi-finished materials ; Laminates ; Polymer industry, paints, wood ; Technology of polymers</subject><ispartof>Polymers & polymer composites, 2006, Vol.14 (1), p.89-105</ispartof><rights>2006 INIST-CNRS</rights><rights>COPYRIGHT 2006 Sage Publications Ltd. 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The polyimide prepolymer was synthesized from 4,4'-diphenylmethane diisocyanate (MDI) and 3,3'-4,4'-benzophenone tetracarboxylic dianhydride (BTDA), after which the prepolymer was reacted respectively with terephthalic acid (TPA), isophthalic acid (IPA), and 4,4'-oxybisbenzonic acid (OBBA) to form PAI-1, PAI-2, and PAI-3. Their chemical structures were characterized using elemental analyses (EA), Fourier transform infrared spectrometry (FTIR), and nuclear magnetic resonance (NMR). The thermal properties, electrical properties, solubility, and mechanical properties of these PAIs, and the peel strength retention and electrical properties of PAI/Cu laminates were measured. The dielectric constants of PAI laminates were lower than 5.5 and the dissipation factors were lower than 0.035, and were in the order of PAI-3 < PAI-1 < PAI-2. These PAI/Cu laminates exhibited peel strength higher than 2.30 kN/m under normal circumstances and higher than 2.15 kN/m after heating. The order of peel strength was PAI-1 > PAI-3 > PAI-2.</description><subject>Applied sciences</subject><subject>Exact sciences and technology</subject><subject>Forms of application and semi-finished materials</subject><subject>Laminates</subject><subject>Polymer industry, paints, wood</subject><subject>Technology of polymers</subject><issn>0967-3911</issn><issn>1478-2391</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2006</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>BENPR</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNplkdFq3TAMhs3oYKddX6BXYdDepbUUJ44vS2m3QWEXXa-D4tirS2KndrJx3r4Op1DoEEhC-n7xgxg7A34JIOUVV42sFABvOAjOgatPbAdCtiXm8RHbbUC5EV_YcUrPnCM0Tb1jDw97vzyZ5FJBfigm8qslvazRFMEWcxj3NLnBlG7LVzrMs4mFDW4sxrzwtJhU_HPLU1iXgobt0F_zlX22NCZz-lZP2OPd7e-bH-X9r-8_b67vS11JsZStrRRhIxB5K2upezSAhpTAHnDrBtU3da-VENATIFZWcElQ1dC2StrqhF0c7s4xvKwmLd3kkjbjSN6ENXWokCuFdQa_fQCfwxp99taBkqIWEqoMXR6gPzSaznkblkg6x2Amp4M31uX5NbS8VojAswAPAh1DStHYbo5uorjvgHfbV7r_v5JF529WKGkabSSvXXpXStFky7x6BcXrisI</recordid><startdate>2006</startdate><enddate>2006</enddate><creator>HUANG, Meng-Shun</creator><creator>YANG, Ming-Chien</creator><creator>SHEN CHOU</creator><general>Rapra Technology</general><general>Sage Publications Ltd. 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The polyimide prepolymer was synthesized from 4,4'-diphenylmethane diisocyanate (MDI) and 3,3'-4,4'-benzophenone tetracarboxylic dianhydride (BTDA), after which the prepolymer was reacted respectively with terephthalic acid (TPA), isophthalic acid (IPA), and 4,4'-oxybisbenzonic acid (OBBA) to form PAI-1, PAI-2, and PAI-3. Their chemical structures were characterized using elemental analyses (EA), Fourier transform infrared spectrometry (FTIR), and nuclear magnetic resonance (NMR). The thermal properties, electrical properties, solubility, and mechanical properties of these PAIs, and the peel strength retention and electrical properties of PAI/Cu laminates were measured. The dielectric constants of PAI laminates were lower than 5.5 and the dissipation factors were lower than 0.035, and were in the order of PAI-3 < PAI-1 < PAI-2. These PAI/Cu laminates exhibited peel strength higher than 2.30 kN/m under normal circumstances and higher than 2.15 kN/m after heating. The order of peel strength was PAI-1 > PAI-3 > PAI-2.</abstract><cop>Shrewsbury</cop><pub>Rapra Technology</pub><doi>10.1177/096739110601400109</doi><tpages>17</tpages></addata></record> |
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| source | Sage Journals GOLD Open Access 2024; EZB-FREE-00999 freely available EZB journals |
| subjects | Applied sciences Exact sciences and technology Forms of application and semi-finished materials Laminates Polymer industry, paints, wood Technology of polymers |
| title | Synthesis and manufacture of polyamide-imide/copper foil laminates without adhesive |
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