Development of an anodically-bonded test surface to obtain fundamental liquid immersion thermal management data for electronic devices

The study described in this paper aims at designing and developing the fabrication technique for an enhanced surface heat sink to document one dimensional pool boiling heat transfer data. The heat sink was designed to simulate a multichip module and symmetry was incorporated to eliminate back heat l...

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Veröffentlicht in:	Sensors and actuators. A. Physical. 2004-07, Vol.113 (2), p.212-217
Hauptverfasser:	Nimkar, Nitesh D., Bhavnani, Sushil H., Ellis, Charles D., Jaeger, Richard C.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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