Dry release of all-polymer structures
We present a simple dry release technique which uses a thin fluorocarbon film for efficient removal of plastic microdevices from a mould or a handling substrate by reducing the adhesion between the two. This fluorocarbon film is deposited on the substrate in an advanced Si dry etch device utilising...
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| Veröffentlicht in: | Microelectronic engineering 2005-03, Vol.78, p.88-92 |
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| container_end_page | 92 |
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| container_title | Microelectronic engineering |
| container_volume | 78 |
| creator | Haefliger, D. Nordström, M. Rasmussen, P.A. Boisen, A. |
| description | We present a simple dry release technique which uses a thin fluorocarbon film for efficient removal of plastic microdevices from a mould or a handling substrate by reducing the adhesion between the two. This fluorocarbon film is deposited on the substrate in an advanced Si dry etch device utilising the C
4F
8 passivation plasma. Micromachined polymer chips made of SU-8 are removed from the handling substrate by lifting them off using mechanical tweezers. Effective release of chips of several mm
2 size within a few seconds and the lift-off of fragile, 5.5-μm-thin cantilevers at a yield of almost 100% were demonstrated on wafer-scale. The fluorocarbon film showed excellent compatibility with metal etch processes and polymer baking and curing steps. It further facilitates demoulding of polydimethylsiloxane stamps suitable for soft-lithography. |
| doi_str_mv | 10.1016/j.mee.2004.12.013 |
| format | Article |
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4F
8 passivation plasma. Micromachined polymer chips made of SU-8 are removed from the handling substrate by lifting them off using mechanical tweezers. Effective release of chips of several mm
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4F
8 passivation plasma. Micromachined polymer chips made of SU-8 are removed from the handling substrate by lifting them off using mechanical tweezers. Effective release of chips of several mm
2 size within a few seconds and the lift-off of fragile, 5.5-μm-thin cantilevers at a yield of almost 100% were demonstrated on wafer-scale. The fluorocarbon film showed excellent compatibility with metal etch processes and polymer baking and curing steps. It further facilitates demoulding of polydimethylsiloxane stamps suitable for soft-lithography.</description><subject>Applied sciences</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Fluorocarbon film</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Plasma deposition</subject><subject>Polymer</subject><subject>Release</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Soft-lithography</subject><subject>SU-8</subject><issn>0167-9317</issn><issn>1873-5568</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><recordid>eNp9kE1rwzAMhs3YYF23H7BbLt0tmRQnccxOo_uEwi7b2biODC5O09nJoP9-Li3sNl2E4NEr9DB2i1AgYHO_KXqiogSoCiwLQH7GZtgKntd1056zWWJELjmKS3YV4wbSXEE7Y4unsM8CedKRssFm2vt8N_h9TyGLY5jMOAWK1-zCah_p5tTn7Ovl-XP5lq8-Xt-Xj6vc8Lod8wpLBFmuxaE4cW4qqzsgkCireq1lxxEER-JdTS0KLo21sgUwvAFTaT5nd8fcXRi-J4qj6l005L3e0jBFVaYgAbVMIB5BE4YYA1m1C67XYa8Q1EGI2qgkRB2EKCxVEpJ2FqdwHY32NuitcfFvsWkE8hYT93DkKH364yioaBxtDXUukBlVN7h_rvwCJzhzOw</recordid><startdate>20050301</startdate><enddate>20050301</enddate><creator>Haefliger, D.</creator><creator>Nordström, M.</creator><creator>Rasmussen, P.A.</creator><creator>Boisen, A.</creator><general>Elsevier B.V</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>20050301</creationdate><title>Dry release of all-polymer structures</title><author>Haefliger, D. ; Nordström, M. ; Rasmussen, P.A. ; Boisen, A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c358t-4121092b777773e33c4fad0e091945ba9d310731e3d5e81739cff9800c360c4a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Applied sciences</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Fluorocarbon film</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Plasma deposition</topic><topic>Polymer</topic><topic>Release</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Soft-lithography</topic><topic>SU-8</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Haefliger, D.</creatorcontrib><creatorcontrib>Nordström, M.</creatorcontrib><creatorcontrib>Rasmussen, P.A.</creatorcontrib><creatorcontrib>Boisen, A.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Microelectronic engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Haefliger, D.</au><au>Nordström, M.</au><au>Rasmussen, P.A.</au><au>Boisen, A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Dry release of all-polymer structures</atitle><jtitle>Microelectronic engineering</jtitle><date>2005-03-01</date><risdate>2005</risdate><volume>78</volume><spage>88</spage><epage>92</epage><pages>88-92</pages><issn>0167-9317</issn><eissn>1873-5568</eissn><coden>MIENEF</coden><abstract>We present a simple dry release technique which uses a thin fluorocarbon film for efficient removal of plastic microdevices from a mould or a handling substrate by reducing the adhesion between the two. This fluorocarbon film is deposited on the substrate in an advanced Si dry etch device utilising the C
4F
8 passivation plasma. Micromachined polymer chips made of SU-8 are removed from the handling substrate by lifting them off using mechanical tweezers. Effective release of chips of several mm
2 size within a few seconds and the lift-off of fragile, 5.5-μm-thin cantilevers at a yield of almost 100% were demonstrated on wafer-scale. The fluorocarbon film showed excellent compatibility with metal etch processes and polymer baking and curing steps. It further facilitates demoulding of polydimethylsiloxane stamps suitable for soft-lithography.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.mee.2004.12.013</doi><tpages>5</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0167-9317 |
| ispartof | Microelectronic engineering, 2005-03, Vol.78, p.88-92 |
| issn | 0167-9317 1873-5568 |
| language | eng |
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| source | Access via ScienceDirect (Elsevier) |
| subjects | Applied sciences Electronics Exact sciences and technology Fluorocarbon film Microelectronic fabrication (materials and surfaces technology) Plasma deposition Polymer Release Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Soft-lithography SU-8 |
| title | Dry release of all-polymer structures |
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