A constitutive model for a high lead solder
High lead solders have been widely used in chip scale packaging. This paper presents a comprehensive study of the various properties, such as Young's moduli, creep, plasticity, cyclic hardening and softening, fatigue, of a typical high lead solder, 96.5Pb-3.5Sn. Based on these studies, a unifie...
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| Veröffentlicht in: | IEEE transactions on components and packaging technologies 2002-03, Vol.25 (1), p.23-31 |
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| container_title | IEEE transactions on components and packaging technologies |
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| creator | Shengmin Wen Keer, L.A. Vaynman, S. Lawson, L.R. |
| description | High lead solders have been widely used in chip scale packaging. This paper presents a comprehensive study of the various properties, such as Young's moduli, creep, plasticity, cyclic hardening and softening, fatigue, of a typical high lead solder, 96.5Pb-3.5Sn. Based on these studies, a unified creep and plasticity approach, incorporating damage, is adopted to construct a three-dimensional constitutive model for this solder. The model is then used to simulate cyclic hardening and softening behavior, isothermal and nonisothermal loading, and damage during the fatigue process. Experimental results from uniaxial tension tests are used to verify the model and good agreement has been achieved. |
| doi_str_mv | 10.1109/6144.991171 |
| format | Article |
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This paper presents a comprehensive study of the various properties, such as Young's moduli, creep, plasticity, cyclic hardening and softening, fatigue, of a typical high lead solder, 96.5Pb-3.5Sn. Based on these studies, a unified creep and plasticity approach, incorporating damage, is adopted to construct a three-dimensional constitutive model for this solder. The model is then used to simulate cyclic hardening and softening behavior, isothermal and nonisothermal loading, and damage during the fatigue process. Experimental results from uniaxial tension tests are used to verify the model and good agreement has been achieved.</description><identifier>ISSN: 1521-3331</identifier><identifier>EISSN: 1557-9972</identifier><identifier>DOI: 10.1109/6144.991171</identifier><identifier>CODEN: ITCPFB</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Constitutive relationships ; Creep ; Creep (materials) ; Damage ; Fatigue ; Geometry ; Lead ; Materials testing ; Mathematical models ; Packaging ; Softening ; Solders ; Substrates ; Temperature ; Tensile tests ; Thermal expansion ; Thermal loading</subject><ispartof>IEEE transactions on components and packaging technologies, 2002-03, Vol.25 (1), p.23-31</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2002</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c372t-98d5c744fcc69439d0a6522ec60b7d76a3c87bf07b8439f096f5f75834f94ea03</citedby><cites>FETCH-LOGICAL-c372t-98d5c744fcc69439d0a6522ec60b7d76a3c87bf07b8439f096f5f75834f94ea03</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/991171$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/991171$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Shengmin Wen</creatorcontrib><creatorcontrib>Keer, L.A.</creatorcontrib><creatorcontrib>Vaynman, S.</creatorcontrib><creatorcontrib>Lawson, L.R.</creatorcontrib><title>A constitutive model for a high lead solder</title><title>IEEE transactions on components and packaging technologies</title><addtitle>TCAPT</addtitle><description>High lead solders have been widely used in chip scale packaging. This paper presents a comprehensive study of the various properties, such as Young's moduli, creep, plasticity, cyclic hardening and softening, fatigue, of a typical high lead solder, 96.5Pb-3.5Sn. Based on these studies, a unified creep and plasticity approach, incorporating damage, is adopted to construct a three-dimensional constitutive model for this solder. The model is then used to simulate cyclic hardening and softening behavior, isothermal and nonisothermal loading, and damage during the fatigue process. Experimental results from uniaxial tension tests are used to verify the model and good agreement has been achieved.</description><subject>Constitutive relationships</subject><subject>Creep</subject><subject>Creep (materials)</subject><subject>Damage</subject><subject>Fatigue</subject><subject>Geometry</subject><subject>Lead</subject><subject>Materials testing</subject><subject>Mathematical models</subject><subject>Packaging</subject><subject>Softening</subject><subject>Solders</subject><subject>Substrates</subject><subject>Temperature</subject><subject>Tensile tests</subject><subject>Thermal expansion</subject><subject>Thermal loading</subject><issn>1521-3331</issn><issn>1557-9972</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2002</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqF0U1LAzEQBuAgCtbqyZunxYMIZWsm3zmW4hcUvOg5pNnEbtk2NdkV_Pfu0uLBg55mYB5mGF6ELgFPAbC-E8DYVGsACUdoBJzLUmtJjoeeQEkphVN0lvMaY2CK6RGazAoXt7mt266tP32xiZVvihBTYYtV_b4qGm-rIsem8ukcnQTbZH9xqGP09nD_On8qFy-Pz_PZonRUkrbUquJOMhacE5pRXWErOCHeCbyUlRSWOiWXAcul6qcBaxF4kFxRFjTzFtMxutnv3aX40fncmk2dnW8au_Wxy4bo_r9-5f9QEaBS8x7e_glBSGAggMieXv-i69ilbf-vUYoxSrgeDk_2yKWYc_LB7FK9senLADZDEmZIwuyT6PXVXtfe-x95GH4Dmnh_qg</recordid><startdate>20020301</startdate><enddate>20020301</enddate><creator>Shengmin Wen</creator><creator>Keer, L.A.</creator><creator>Vaynman, S.</creator><creator>Lawson, L.R.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>L7M</scope><scope>7TB</scope></search><sort><creationdate>20020301</creationdate><title>A constitutive model for a high lead solder</title><author>Shengmin Wen ; Keer, L.A. ; Vaynman, S. ; Lawson, L.R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c372t-98d5c744fcc69439d0a6522ec60b7d76a3c87bf07b8439f096f5f75834f94ea03</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Constitutive relationships</topic><topic>Creep</topic><topic>Creep (materials)</topic><topic>Damage</topic><topic>Fatigue</topic><topic>Geometry</topic><topic>Lead</topic><topic>Materials testing</topic><topic>Mathematical models</topic><topic>Packaging</topic><topic>Softening</topic><topic>Solders</topic><topic>Substrates</topic><topic>Temperature</topic><topic>Tensile tests</topic><topic>Thermal expansion</topic><topic>Thermal loading</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Shengmin Wen</creatorcontrib><creatorcontrib>Keer, L.A.</creatorcontrib><creatorcontrib>Vaynman, S.</creatorcontrib><creatorcontrib>Lawson, L.R.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><jtitle>IEEE transactions on components and packaging technologies</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Shengmin Wen</au><au>Keer, L.A.</au><au>Vaynman, S.</au><au>Lawson, L.R.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A constitutive model for a high lead solder</atitle><jtitle>IEEE transactions on components and packaging technologies</jtitle><stitle>TCAPT</stitle><date>2002-03-01</date><risdate>2002</risdate><volume>25</volume><issue>1</issue><spage>23</spage><epage>31</epage><pages>23-31</pages><issn>1521-3331</issn><eissn>1557-9972</eissn><coden>ITCPFB</coden><abstract>High lead solders have been widely used in chip scale packaging. This paper presents a comprehensive study of the various properties, such as Young's moduli, creep, plasticity, cyclic hardening and softening, fatigue, of a typical high lead solder, 96.5Pb-3.5Sn. Based on these studies, a unified creep and plasticity approach, incorporating damage, is adopted to construct a three-dimensional constitutive model for this solder. The model is then used to simulate cyclic hardening and softening behavior, isothermal and nonisothermal loading, and damage during the fatigue process. Experimental results from uniaxial tension tests are used to verify the model and good agreement has been achieved.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/6144.991171</doi><tpages>9</tpages></addata></record> |
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| source | IEEE Electronic Library (IEL) |
| subjects | Constitutive relationships Creep Creep (materials) Damage Fatigue Geometry Lead Materials testing Mathematical models Packaging Softening Solders Substrates Temperature Tensile tests Thermal expansion Thermal loading |
| title | A constitutive model for a high lead solder |
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