A Fluorine-Containing Main-Chain Benzoxazine/Epoxy Co-Curing System with Low Dielectric Constants and High Thermal Stability
A fluorine-containing main-chain benzoxazine (BAF-M-TB) was co-cured with biphenyl epoxy for the integrated circuit industry. The benzoxazine precursor was synthesized using 4,4'-(Hexafluoroisopropylidene)diphenol (bisphenol AF), 2,2'-Dimethyl-[1,1'-biphenyl]-4,4'-Diamine(M-TB),...
Gespeichert in:
| Veröffentlicht in: | Polymers 2023-11, Vol.15 (23), p.4487 |
|---|---|
| Hauptverfasser: | , , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | 23 |
| container_start_page | 4487 |
| container_title | Polymers |
| container_volume | 15 |
| creator | Zhang, Tinghao Zhang, Wenzheng Ding, Zichun Jiao, Jianjian Wang, Jinyan Zhang, Wei |
| description | A fluorine-containing main-chain benzoxazine (BAF-M-TB) was co-cured with biphenyl epoxy for the integrated circuit industry. The benzoxazine precursor was synthesized using 4,4'-(Hexafluoroisopropylidene)diphenol (bisphenol AF), 2,2'-Dimethyl-[1,1'-biphenyl]-4,4'-Diamine(M-TB), and paraformaldehyde. In addition, the 3,3'-(Oxybis(4,1-phenylene))bis(3,4-dihydro-2H-benzo[e][1,3]oxazine) (Benoxazine ODA-BOZ), which is a commercialized benzoxazine, was co-cured with biphenyl epoxy as a control. The two co-curing systems were referred to as EP/BAF-M-TB and EP/ODA-BOZ. The curing kinetics, rheological behavior, and thermal stability of the two co-curing systems were studied. Poly-EP/BAF-M-TB and poly-EP/ODA-BOZ quartz fiber cloth reinforced composites (QFRPs) were prepared using the prepreg laminating method in order to determine their mechanical, thermal, and dielectric properties. Both of them showed good thermal properties and dielectric properties. The dielectric constant of poly-EP/BAF-M-TB QFRP is in the range of 3.25-3.54 at the low frequency of 10 kHz-10 MHz. At the high frequency of 5 GHz, its dielectric constant is 3.16, which is better than that of poly-EP/ODA-BOZ QFRP. Additionally, the Td
of poly-EP/BAF-M-TB was 398 °C in a nitrogen atmosphere, which is higher than that of poly-EP/ODA-BOZ. |
| doi_str_mv | 10.3390/polym15234487 |
| format | Article |
| fullrecord | <record><control><sourceid>gale_proqu</sourceid><recordid>TN_cdi_proquest_miscellaneous_2916408555</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><galeid>A775891884</galeid><sourcerecordid>A775891884</sourcerecordid><originalsourceid>FETCH-LOGICAL-c399t-e2e05644de85dd5342c2900260c0d1bfec245ea28012be3e08498c989ba182573</originalsourceid><addsrcrecordid>eNpdkc1r3DAQxU1paEKaY65F0EsvTvRpS8etmzSFLTkkORtZHu8q2NJWkkkc-sdXy6al7QhmhPi90YNXFOcEXzCm8OXOj8tEBGWcy_pNcUJxzUrOKvz2r_txcRbjI87FRVWR-l1xzCRlRGF8Uvxcoetx9sE6KBvvkrbOug36nmfZbHNHn8G9-Gf9konLq51_XlDjy2YOe-xuiQkm9GTTFq39E_piYQSTgjUZcjFplyLSrkc3drNF91sIkx7RXdKdHW1a3hdHgx4jnL3O0-Lh-uq-uSnXt1-_Nat1aZhSqQQKWFSc9yBF3wvGqaHZPK2wwT3pBjCUC9BUYkI7YIAlV9IoqTpNJBU1Oy0-Hfbugv8xQ0ztZKOBcdQO_BxbqkjFsRRCZPTjf-ijn4PL7loqleIs_7tfeHGgNnqE1rrBp6BNPj1M1ngHg83vq7oWUhEpeRaUB4EJPsYAQ7sLdtJhaQlu91G2_0SZ-Q-vNuZugv4P_Ts49gvl55k7</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2899430027</pqid></control><display><type>article</type><title>A Fluorine-Containing Main-Chain Benzoxazine/Epoxy Co-Curing System with Low Dielectric Constants and High Thermal Stability</title><source>PubMed Central Open Access</source><source>MDPI - Multidisciplinary Digital Publishing Institute</source><source>EZB-FREE-00999 freely available EZB journals</source><source>PubMed Central</source><creator>Zhang, Tinghao ; Zhang, Wenzheng ; Ding, Zichun ; Jiao, Jianjian ; Wang, Jinyan ; Zhang, Wei</creator><creatorcontrib>Zhang, Tinghao ; Zhang, Wenzheng ; Ding, Zichun ; Jiao, Jianjian ; Wang, Jinyan ; Zhang, Wei</creatorcontrib><description>A fluorine-containing main-chain benzoxazine (BAF-M-TB) was co-cured with biphenyl epoxy for the integrated circuit industry. The benzoxazine precursor was synthesized using 4,4'-(Hexafluoroisopropylidene)diphenol (bisphenol AF), 2,2'-Dimethyl-[1,1'-biphenyl]-4,4'-Diamine(M-TB), and paraformaldehyde. In addition, the 3,3'-(Oxybis(4,1-phenylene))bis(3,4-dihydro-2H-benzo[e][1,3]oxazine) (Benoxazine ODA-BOZ), which is a commercialized benzoxazine, was co-cured with biphenyl epoxy as a control. The two co-curing systems were referred to as EP/BAF-M-TB and EP/ODA-BOZ. The curing kinetics, rheological behavior, and thermal stability of the two co-curing systems were studied. Poly-EP/BAF-M-TB and poly-EP/ODA-BOZ quartz fiber cloth reinforced composites (QFRPs) were prepared using the prepreg laminating method in order to determine their mechanical, thermal, and dielectric properties. Both of them showed good thermal properties and dielectric properties. The dielectric constant of poly-EP/BAF-M-TB QFRP is in the range of 3.25-3.54 at the low frequency of 10 kHz-10 MHz. At the high frequency of 5 GHz, its dielectric constant is 3.16, which is better than that of poly-EP/ODA-BOZ QFRP. Additionally, the Td
of poly-EP/BAF-M-TB was 398 °C in a nitrogen atmosphere, which is higher than that of poly-EP/ODA-BOZ.</description><identifier>ISSN: 2073-4360</identifier><identifier>EISSN: 2073-4360</identifier><identifier>DOI: 10.3390/polym15234487</identifier><identifier>PMID: 38231900</identifier><language>eng</language><publisher>Switzerland: MDPI AG</publisher><subject>Adhesives ; Benzoxazines ; Caustic soda ; Chromatography ; Coatings ; Commercialization ; Composite materials ; Curing ; Diamines ; Dielectric properties ; Electric properties ; Epoxy resins ; Fluorine ; Fluorine compounds ; Fourier transforms ; Hydrogen ; Hydrogen bonding ; Hydrogenation ; Integrated circuits ; Laminating ; NMR ; Nuclear magnetic resonance ; Permittivity ; Rheological properties ; Spectrum analysis ; Temperature ; Thermal stability ; Thermodynamic properties</subject><ispartof>Polymers, 2023-11, Vol.15 (23), p.4487</ispartof><rights>COPYRIGHT 2023 MDPI AG</rights><rights>2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c399t-e2e05644de85dd5342c2900260c0d1bfec245ea28012be3e08498c989ba182573</citedby><cites>FETCH-LOGICAL-c399t-e2e05644de85dd5342c2900260c0d1bfec245ea28012be3e08498c989ba182573</cites><orcidid>0009-0004-9841-9412 ; 0000-0002-5953-9794 ; 0000-0003-3707-6765</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,777,781,27905,27906</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/38231900$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Zhang, Tinghao</creatorcontrib><creatorcontrib>Zhang, Wenzheng</creatorcontrib><creatorcontrib>Ding, Zichun</creatorcontrib><creatorcontrib>Jiao, Jianjian</creatorcontrib><creatorcontrib>Wang, Jinyan</creatorcontrib><creatorcontrib>Zhang, Wei</creatorcontrib><title>A Fluorine-Containing Main-Chain Benzoxazine/Epoxy Co-Curing System with Low Dielectric Constants and High Thermal Stability</title><title>Polymers</title><addtitle>Polymers (Basel)</addtitle><description>A fluorine-containing main-chain benzoxazine (BAF-M-TB) was co-cured with biphenyl epoxy for the integrated circuit industry. The benzoxazine precursor was synthesized using 4,4'-(Hexafluoroisopropylidene)diphenol (bisphenol AF), 2,2'-Dimethyl-[1,1'-biphenyl]-4,4'-Diamine(M-TB), and paraformaldehyde. In addition, the 3,3'-(Oxybis(4,1-phenylene))bis(3,4-dihydro-2H-benzo[e][1,3]oxazine) (Benoxazine ODA-BOZ), which is a commercialized benzoxazine, was co-cured with biphenyl epoxy as a control. The two co-curing systems were referred to as EP/BAF-M-TB and EP/ODA-BOZ. The curing kinetics, rheological behavior, and thermal stability of the two co-curing systems were studied. Poly-EP/BAF-M-TB and poly-EP/ODA-BOZ quartz fiber cloth reinforced composites (QFRPs) were prepared using the prepreg laminating method in order to determine their mechanical, thermal, and dielectric properties. Both of them showed good thermal properties and dielectric properties. The dielectric constant of poly-EP/BAF-M-TB QFRP is in the range of 3.25-3.54 at the low frequency of 10 kHz-10 MHz. At the high frequency of 5 GHz, its dielectric constant is 3.16, which is better than that of poly-EP/ODA-BOZ QFRP. Additionally, the Td
of poly-EP/BAF-M-TB was 398 °C in a nitrogen atmosphere, which is higher than that of poly-EP/ODA-BOZ.</description><subject>Adhesives</subject><subject>Benzoxazines</subject><subject>Caustic soda</subject><subject>Chromatography</subject><subject>Coatings</subject><subject>Commercialization</subject><subject>Composite materials</subject><subject>Curing</subject><subject>Diamines</subject><subject>Dielectric properties</subject><subject>Electric properties</subject><subject>Epoxy resins</subject><subject>Fluorine</subject><subject>Fluorine compounds</subject><subject>Fourier transforms</subject><subject>Hydrogen</subject><subject>Hydrogen bonding</subject><subject>Hydrogenation</subject><subject>Integrated circuits</subject><subject>Laminating</subject><subject>NMR</subject><subject>Nuclear magnetic resonance</subject><subject>Permittivity</subject><subject>Rheological properties</subject><subject>Spectrum analysis</subject><subject>Temperature</subject><subject>Thermal stability</subject><subject>Thermodynamic properties</subject><issn>2073-4360</issn><issn>2073-4360</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNpdkc1r3DAQxU1paEKaY65F0EsvTvRpS8etmzSFLTkkORtZHu8q2NJWkkkc-sdXy6al7QhmhPi90YNXFOcEXzCm8OXOj8tEBGWcy_pNcUJxzUrOKvz2r_txcRbjI87FRVWR-l1xzCRlRGF8Uvxcoetx9sE6KBvvkrbOug36nmfZbHNHn8G9-Gf9konLq51_XlDjy2YOe-xuiQkm9GTTFq39E_piYQSTgjUZcjFplyLSrkc3drNF91sIkx7RXdKdHW1a3hdHgx4jnL3O0-Lh-uq-uSnXt1-_Nat1aZhSqQQKWFSc9yBF3wvGqaHZPK2wwT3pBjCUC9BUYkI7YIAlV9IoqTpNJBU1Oy0-Hfbugv8xQ0ztZKOBcdQO_BxbqkjFsRRCZPTjf-ijn4PL7loqleIs_7tfeHGgNnqE1rrBp6BNPj1M1ngHg83vq7oWUhEpeRaUB4EJPsYAQ7sLdtJhaQlu91G2_0SZ-Q-vNuZugv4P_Ts49gvl55k7</recordid><startdate>20231122</startdate><enddate>20231122</enddate><creator>Zhang, Tinghao</creator><creator>Zhang, Wenzheng</creator><creator>Ding, Zichun</creator><creator>Jiao, Jianjian</creator><creator>Wang, Jinyan</creator><creator>Zhang, Wei</creator><general>MDPI AG</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>PDBOC</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>7X8</scope><orcidid>https://orcid.org/0009-0004-9841-9412</orcidid><orcidid>https://orcid.org/0000-0002-5953-9794</orcidid><orcidid>https://orcid.org/0000-0003-3707-6765</orcidid></search><sort><creationdate>20231122</creationdate><title>A Fluorine-Containing Main-Chain Benzoxazine/Epoxy Co-Curing System with Low Dielectric Constants and High Thermal Stability</title><author>Zhang, Tinghao ; Zhang, Wenzheng ; Ding, Zichun ; Jiao, Jianjian ; Wang, Jinyan ; Zhang, Wei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c399t-e2e05644de85dd5342c2900260c0d1bfec245ea28012be3e08498c989ba182573</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2023</creationdate><topic>Adhesives</topic><topic>Benzoxazines</topic><topic>Caustic soda</topic><topic>Chromatography</topic><topic>Coatings</topic><topic>Commercialization</topic><topic>Composite materials</topic><topic>Curing</topic><topic>Diamines</topic><topic>Dielectric properties</topic><topic>Electric properties</topic><topic>Epoxy resins</topic><topic>Fluorine</topic><topic>Fluorine compounds</topic><topic>Fourier transforms</topic><topic>Hydrogen</topic><topic>Hydrogen bonding</topic><topic>Hydrogenation</topic><topic>Integrated circuits</topic><topic>Laminating</topic><topic>NMR</topic><topic>Nuclear magnetic resonance</topic><topic>Permittivity</topic><topic>Rheological properties</topic><topic>Spectrum analysis</topic><topic>Temperature</topic><topic>Thermal stability</topic><topic>Thermodynamic properties</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zhang, Tinghao</creatorcontrib><creatorcontrib>Zhang, Wenzheng</creatorcontrib><creatorcontrib>Ding, Zichun</creatorcontrib><creatorcontrib>Jiao, Jianjian</creatorcontrib><creatorcontrib>Wang, Jinyan</creatorcontrib><creatorcontrib>Zhang, Wei</creatorcontrib><collection>PubMed</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Materials Science Collection</collection><collection>Publicly Available Content Database</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>MEDLINE - Academic</collection><jtitle>Polymers</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zhang, Tinghao</au><au>Zhang, Wenzheng</au><au>Ding, Zichun</au><au>Jiao, Jianjian</au><au>Wang, Jinyan</au><au>Zhang, Wei</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A Fluorine-Containing Main-Chain Benzoxazine/Epoxy Co-Curing System with Low Dielectric Constants and High Thermal Stability</atitle><jtitle>Polymers</jtitle><addtitle>Polymers (Basel)</addtitle><date>2023-11-22</date><risdate>2023</risdate><volume>15</volume><issue>23</issue><spage>4487</spage><pages>4487-</pages><issn>2073-4360</issn><eissn>2073-4360</eissn><abstract>A fluorine-containing main-chain benzoxazine (BAF-M-TB) was co-cured with biphenyl epoxy for the integrated circuit industry. The benzoxazine precursor was synthesized using 4,4'-(Hexafluoroisopropylidene)diphenol (bisphenol AF), 2,2'-Dimethyl-[1,1'-biphenyl]-4,4'-Diamine(M-TB), and paraformaldehyde. In addition, the 3,3'-(Oxybis(4,1-phenylene))bis(3,4-dihydro-2H-benzo[e][1,3]oxazine) (Benoxazine ODA-BOZ), which is a commercialized benzoxazine, was co-cured with biphenyl epoxy as a control. The two co-curing systems were referred to as EP/BAF-M-TB and EP/ODA-BOZ. The curing kinetics, rheological behavior, and thermal stability of the two co-curing systems were studied. Poly-EP/BAF-M-TB and poly-EP/ODA-BOZ quartz fiber cloth reinforced composites (QFRPs) were prepared using the prepreg laminating method in order to determine their mechanical, thermal, and dielectric properties. Both of them showed good thermal properties and dielectric properties. The dielectric constant of poly-EP/BAF-M-TB QFRP is in the range of 3.25-3.54 at the low frequency of 10 kHz-10 MHz. At the high frequency of 5 GHz, its dielectric constant is 3.16, which is better than that of poly-EP/ODA-BOZ QFRP. Additionally, the Td
of poly-EP/BAF-M-TB was 398 °C in a nitrogen atmosphere, which is higher than that of poly-EP/ODA-BOZ.</abstract><cop>Switzerland</cop><pub>MDPI AG</pub><pmid>38231900</pmid><doi>10.3390/polym15234487</doi><orcidid>https://orcid.org/0009-0004-9841-9412</orcidid><orcidid>https://orcid.org/0000-0002-5953-9794</orcidid><orcidid>https://orcid.org/0000-0003-3707-6765</orcidid><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 2073-4360 |
| ispartof | Polymers, 2023-11, Vol.15 (23), p.4487 |
| issn | 2073-4360 2073-4360 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_2916408555 |
| source | PubMed Central Open Access; MDPI - Multidisciplinary Digital Publishing Institute; EZB-FREE-00999 freely available EZB journals; PubMed Central |
| subjects | Adhesives Benzoxazines Caustic soda Chromatography Coatings Commercialization Composite materials Curing Diamines Dielectric properties Electric properties Epoxy resins Fluorine Fluorine compounds Fourier transforms Hydrogen Hydrogen bonding Hydrogenation Integrated circuits Laminating NMR Nuclear magnetic resonance Permittivity Rheological properties Spectrum analysis Temperature Thermal stability Thermodynamic properties |
| title | A Fluorine-Containing Main-Chain Benzoxazine/Epoxy Co-Curing System with Low Dielectric Constants and High Thermal Stability |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T00%3A56%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-gale_proqu&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=A%20Fluorine-Containing%20Main-Chain%20Benzoxazine/Epoxy%20Co-Curing%20System%20with%20Low%20Dielectric%20Constants%20and%20High%20Thermal%20Stability&rft.jtitle=Polymers&rft.au=Zhang,%20Tinghao&rft.date=2023-11-22&rft.volume=15&rft.issue=23&rft.spage=4487&rft.pages=4487-&rft.issn=2073-4360&rft.eissn=2073-4360&rft_id=info:doi/10.3390/polym15234487&rft_dat=%3Cgale_proqu%3EA775891884%3C/gale_proqu%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2899430027&rft_id=info:pmid/38231900&rft_galeid=A775891884&rfr_iscdi=true |