Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability

Power device packages with solder-bump (SB) and direct-solder (DS) interconnections were fabricated and some of their thermomechanical reliability issues were discussed based on both thermal cycling experiment and finite element analysis (FEA). The SB interconnection shows superior reliability over...

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Veröffentlicht in:	Journal of electronic packaging 2006-09, Vol.128 (3), p.208-214
Hauptverfasser:	Bai, John G, Calata, Jesus N, Lu, Guo-Quan
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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