Closing the Gap Between Self-Assembly and Microsystems Using Self-Assembly, Transfer, and Integration of Particles

Self‐assembly, transfer, and integration of particles is achieved by combining self‐assembly processes with an adhesion cascade (see Figure). This process complements and enhances existing fabrication methods as it allows the integration of particles into planar devices. Moreover, it is versatile in terms of particle size and materials, and can create arbitrary particle arrangements with functional particle–substrate connections.