BaTiO3 Films by Low-Temperature Hydrothermal Techniques for Next Generation Packaging Applications
The synthesis, characterisation and integration of sub-micron thick nano-grained barium titanate films on organic printed wiring boards (PWB) are reported. Barium titanate films were synthesised on titanium foils at 95 C. SEM revealed 80 nm grains. The films were characterised by XRD, FTIR and Raman...
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| Veröffentlicht in: | Journal of electroceramics 2004-07, Vol.13 (1-3), p.95-100 |
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| container_title | Journal of electroceramics |
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| creator | Balaraman, D Raj, P M Wan, L Abothu, I R Bhattacharya, S Dalmia, S Lance, M J Swaminathan, M Sacks, M D Tummala, R R |
| description | The synthesis, characterisation and integration of sub-micron thick nano-grained barium titanate films on organic printed wiring boards (PWB) are reported. Barium titanate films were synthesised on titanium foils at 95 C. SEM revealed 80 nm grains. The films were characterised by XRD, FTIR and Raman spectroscopy. As-synthesised films exhibited high capacitance densities and dielectric loss. The films were treated with oxygen plasma to reduce entrapped hydroxyl groups, resulting in improved dielectric properties. The plasma treated films exhibited a capacitance density of 1 microF/cm2 and a dielectric loss of 0.06. The high frequency dielectric properties were extracted from s-parameter measurements on CPW structures on these films and were stable up to 8 GHz. 13 refs. |
| doi_str_mv | 10.1007/s10832-004-5082-2 |
| format | Article |
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Barium titanate films were synthesised on titanium foils at 95 C. SEM revealed 80 nm grains. The films were characterised by XRD, FTIR and Raman spectroscopy. As-synthesised films exhibited high capacitance densities and dielectric loss. The films were treated with oxygen plasma to reduce entrapped hydroxyl groups, resulting in improved dielectric properties. The plasma treated films exhibited a capacitance density of 1 microF/cm2 and a dielectric loss of 0.06. 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| subjects | Dielectric properties |
| title | BaTiO3 Films by Low-Temperature Hydrothermal Techniques for Next Generation Packaging Applications |
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