Piezocatalysis for Chemical–Mechanical Polishing of SiC: Dual Roles of t‐BaTiO3 as a Piezocatalyst and an Abrasive
Chemical mechanical polishing (CMP) offers a promising pathway to smooth third‐generation semiconductors. However, it is still a challenge to reduce the use of additional oxidants or/and energy in current CMP processes. Here, a new and green atomically smoothing method: Piezocatalytic‐CMP (Piezo‐CMP...
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Veröffentlicht in: | Small (Weinheim an der Bergstrasse, Germany) Germany), 2024-05, Vol.20 (21), p.e2310117-n/a |
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Hauptverfasser: | , , , , , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
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