Piezocatalysis for Chemical–Mechanical Polishing of SiC: Dual Roles of t‐BaTiO3 as a Piezocatalyst and an Abrasive

Chemical mechanical polishing (CMP) offers a promising pathway to smooth third‐generation semiconductors. However, it is still a challenge to reduce the use of additional oxidants or/and energy in current CMP processes. Here, a new and green atomically smoothing method: Piezocatalytic‐CMP (Piezo‐CMP...

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Veröffentlicht in:Small (Weinheim an der Bergstrasse, Germany) Germany), 2024-05, Vol.20 (21), p.e2310117-n/a
Hauptverfasser: Hu, Tao, Feng, Jinxi, Yan, Wen, Tian, Shuanghong, Sun, Jingxiang, Liu, Xiaosheng, Wei, Di, Wang, Ziming, Yu, Yang, Lam, Jason Chun‐Ho, Liu, Shaorong, Wang, Zhong Lin, Xiong, Ya
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Sprache:eng
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