Magnetic In-circuit Testing of Multiple Power and Ground Pins for Open Faults

The viability of magnetically detecting open faults among multiple power and ground pins of an integrated-circuit package is investigated. The experimental technique is based on injecting current to the leadframe through the chip, and individually sensing the lateral magnetic field of each VDD or GN...

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Veröffentlicht in:Journal of electronic testing 2007-02, Vol.23 (1), p.25-34
1. Verfasser: Cilingiroglu, Ugur
Format: Artikel
Sprache:eng
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