Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects

The impact of the Ag content on the microstructure development of the Sn-xAg-Cu (x= 0.0, 1.2, 2.6, 3.0, 3.5 and 3.9) interconnects was studied in detail by using surface microetching microscopy, cross section microscopy, differential scanning calorimetry and shear test. The thermal treatment was rea...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2006-03, Vol.17 (3), p.171-188
Hauptverfasser:	LU, Henry Y, BALKAN, Haluk, NG, K. Y. Simon
Format:	Artikel
Sprache:	eng
Schlagworte:	Aging Alloy plating Alloys Applied sciences Cylinders Electronics Exact sciences and technology Materials Microscopy Microstructure Morphology Plates Silver Supercooling
Online-Zugang:	Volltext
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