Vapor pressure and voiding effects on thin film damage

Plastic encapsulated microcircuits exposed to a humid environment are susceptible to thin film adhesive failures during reflow soldering. Recent computational studies on thin film adhesive failures have adopted void-containing cell elements based on an extended Gurson continuum constitutive model. S...

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Veröffentlicht in:	Thin solid films 2006-05, Vol.504 (1), p.325-330
Hauptverfasser:	Chew, H.B., Guo, T.F., Cheng, L.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Condensed matter: structure, mechanical and thermal properties Defects and impurities in crystals microstructure Discrete voids Exact sciences and technology Fractures Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals. Metallurgy Microscopic defects (voids, inclusions, etc.) Physics Structure of solids and liquids crystallography Thin film Vapor pressure Void shape
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