Reduction of exchange coupling and enhancement of coercivity of L10 FePt(001) films by Cu top layer diffusion
Cu top layer diffusion was used to reduce the exchange coupling of FePt magnetic grains since diffusion along grain boundaries is easier than bulk diffusion. After the deposition of 2 and 4 nm Cu layer on FePt film at 350 DDGC the slope of the out-of-plane M-H loops decreased and the out-of-plane co...
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| Veröffentlicht in: | Thin solid films 2006-05, Vol.505 (1-2), p.81-84 |
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| container_title | Thin solid films |
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| creator | LIM, B. C CHEN, J. S YIN, J. H |
| description | Cu top layer diffusion was used to reduce the exchange coupling of FePt magnetic grains since diffusion along grain boundaries is easier than bulk diffusion. After the deposition of 2 and 4 nm Cu layer on FePt film at 350 DDGC the slope of the out-of-plane M-H loops decreased and the out-of-plane coercivity increased from 3158 Oe to 6050 Oe, suggesting the exchange coupling decreases. The magnetisation reversal mechanism changed from the domain wall motion to the rotation mode with the deposition of Cu top layers. Moment decay measurements based on the Sharrock formula were made to evaluate the thermal stability factor KuV*/kBT and the magnetic switching volume V*. V* was reduced by increased Cu top layer which further confirmed the reduction of exchange coupling. |
| doi_str_mv | 10.1016/j.tsf.2005.10.008 |
| format | Article |
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V* was reduced by increased Cu top layer which further confirmed the reduction of exchange coupling.</description><identifier>ISSN: 0040-6090</identifier><identifier>EISSN: 1879-2731</identifier><identifier>DOI: 10.1016/j.tsf.2005.10.008</identifier><identifier>CODEN: THSFAP</identifier><language>eng</language><publisher>Lausanne: Elsevier Science</publisher><subject>Condensed matter: electronic structure, electrical, magnetic, and optical properties ; Cross-disciplinary physics: materials science; rheology ; Deposition by sputtering ; Exact sciences and technology ; Exchange and superexchange interactions ; Magnetic properties and materials ; Magnetically ordered materials: other intrinsic properties ; Materials science ; Methods of deposition of films and coatings; film growth and epitaxy ; Physics</subject><ispartof>Thin solid films, 2006-05, Vol.505 (1-2), p.81-84</ispartof><rights>2006 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c1518-fa597563725b03bd591bbc7de7f0e3360038cf510b5e8c85d10b09dbb351dfea3</citedby><cites>FETCH-LOGICAL-c1518-fa597563725b03bd591bbc7de7f0e3360038cf510b5e8c85d10b09dbb351dfea3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>309,310,314,780,784,789,790,23930,23931,25140,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=17691915$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>LIM, B. 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V* was reduced by increased Cu top layer which further confirmed the reduction of exchange coupling.</description><subject>Condensed matter: electronic structure, electrical, magnetic, and optical properties</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Deposition by sputtering</subject><subject>Exact sciences and technology</subject><subject>Exchange and superexchange interactions</subject><subject>Magnetic properties and materials</subject><subject>Magnetically ordered materials: other intrinsic properties</subject><subject>Materials science</subject><subject>Methods of deposition of films and coatings; film growth and epitaxy</subject><subject>Physics</subject><issn>0040-6090</issn><issn>1879-2731</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2006</creationdate><recordtype>article</recordtype><recordid>eNpFkE9LxDAQxYMouK5-AG-5KHponTSmTY-yuCosKKLnkKaTNUv_2bRiv70pu-BpZh7vvYEfIZcMYgYsvdvFg7dxAiDCHQPII7JgMsujJOPsmCwA7iFKIYdTcub9DgBYkvAFqd-xHM3g2oa2luKv-dLNFqlpx65yzZbqpqTYBNFgjc0wm0yLvXE_bpjma8OArvFtuAmNt9S6qva0mOhqpEPb0UpP2NPSWTv68OOcnFhdebw4zCX5XD9-rJ6jzevTy-phExkmmIysFnkmUp4logBelCJnRWGyEjMLyHkKwKWxgkEhUBopyrBBXhYFF6y0qPmSXO97u779HtEPqnbeYFXpBtvRq0TKhGepDEa2N5q-9b5Hq7re1bqfFAM1g1U7FcCqGewsBbAhc3Uo197oyvYBjvP_wSzNWc4E_wMcxXk5</recordid><startdate>20060518</startdate><enddate>20060518</enddate><creator>LIM, B. 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H</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c1518-fa597563725b03bd591bbc7de7f0e3360038cf510b5e8c85d10b09dbb351dfea3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Condensed matter: electronic structure, electrical, magnetic, and optical properties</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Deposition by sputtering</topic><topic>Exact sciences and technology</topic><topic>Exchange and superexchange interactions</topic><topic>Magnetic properties and materials</topic><topic>Magnetically ordered materials: other intrinsic properties</topic><topic>Materials science</topic><topic>Methods of deposition of films and coatings; film growth and epitaxy</topic><topic>Physics</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>LIM, B. C</creatorcontrib><creatorcontrib>CHEN, J. S</creatorcontrib><creatorcontrib>YIN, J. H</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Thin solid films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>LIM, B. C</au><au>CHEN, J. S</au><au>YIN, J. H</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Reduction of exchange coupling and enhancement of coercivity of L10 FePt(001) films by Cu top layer diffusion</atitle><jtitle>Thin solid films</jtitle><date>2006-05-18</date><risdate>2006</risdate><volume>505</volume><issue>1-2</issue><spage>81</spage><epage>84</epage><pages>81-84</pages><issn>0040-6090</issn><eissn>1879-2731</eissn><coden>THSFAP</coden><abstract>Cu top layer diffusion was used to reduce the exchange coupling of FePt magnetic grains since diffusion along grain boundaries is easier than bulk diffusion. After the deposition of 2 and 4 nm Cu layer on FePt film at 350 DDGC the slope of the out-of-plane M-H loops decreased and the out-of-plane coercivity increased from 3158 Oe to 6050 Oe, suggesting the exchange coupling decreases. The magnetisation reversal mechanism changed from the domain wall motion to the rotation mode with the deposition of Cu top layers. Moment decay measurements based on the Sharrock formula were made to evaluate the thermal stability factor KuV*/kBT and the magnetic switching volume V*. V* was reduced by increased Cu top layer which further confirmed the reduction of exchange coupling.</abstract><cop>Lausanne</cop><pub>Elsevier Science</pub><doi>10.1016/j.tsf.2005.10.008</doi><tpages>4</tpages></addata></record> |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Condensed matter: electronic structure, electrical, magnetic, and optical properties Cross-disciplinary physics: materials science rheology Deposition by sputtering Exact sciences and technology Exchange and superexchange interactions Magnetic properties and materials Magnetically ordered materials: other intrinsic properties Materials science Methods of deposition of films and coatings film growth and epitaxy Physics |
| title | Reduction of exchange coupling and enhancement of coercivity of L10 FePt(001) films by Cu top layer diffusion |
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