The flip-chip bump interconnection for millimeter-wave GaAs MMIC

The flip-chip bump interconnection structure has become popular for microwave and millimeter-wave package applications. This structure is expected to provide higher performance and a low cost packaging method. This paper presents the results of an evaluation of flip-chip assembled radio frequency (R...

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Veröffentlicht in:	IEEE transactions on electronics packaging manufacturing 1999-01, Vol.22 (1), p.23-28
Hauptverfasser:	Kusamitsu, H., Morishita, Y., Maruhasi, K., Ito, M., Ohata, K.
Format:	Artikel
Sprache:	eng
Schlagworte:	Aluminum oxide Assembly Bonding Computer simulation Finite element method Gallium arsenide Gallium arsenides Integrated circuit interconnections Integrated circuit packaging Interconnection Microwave devices Millimeter wave integrated circuits Millimeter wave technology MMICs Radio frequencies Radio frequency Transmission lines
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