Novel techniques for millimeter-wave packages

A new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented. This package is well suited for discrete devices, monolithic microwave integrated circuits (MMIC's) and multichip module (MCM) applications. It has low-lo...

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Veröffentlicht in:	IEEE transactions on microwave theory and techniques 1995-07, Vol.43 (7), p.1516-1523
Hauptverfasser:	Herman, M.I., Lee, K.A., Kolawa, E.A., Lowry, L.E., Tulintseff, A.N.
Format:	Artikel
Sprache:	eng
Schlagworte:	Application specific integrated circuits Applied sciences Electromagnetic analysis Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Electronics And Electrical Engineering Exact sciences and technology Finite difference methods Integrated circuit packaging Materials science and technology Microwave devices Millimeter wave integrated circuits Millimeter wave technology Thermal management Time domain analysis
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