Novel techniques for millimeter-wave packages
A new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented. This package is well suited for discrete devices, monolithic microwave integrated circuits (MMIC's) and multichip module (MCM) applications. It has low-lo...
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| Veröffentlicht in: | IEEE transactions on microwave theory and techniques 1995-07, Vol.43 (7), p.1516-1523 |
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| container_end_page | 1523 |
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| container_issue | 7 |
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| container_title | IEEE transactions on microwave theory and techniques |
| container_volume | 43 |
| creator | Herman, M.I. Lee, K.A. Kolawa, E.A. Lowry, L.E. Tulintseff, A.N. |
| description | A new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented. This package is well suited for discrete devices, monolithic microwave integrated circuits (MMIC's) and multichip module (MCM) applications. It has low-loss wideband RF transitions which are necessary to overcome manufacturing tolerances leading to lower per unit cost. Potential applications of this new packaging architecture which go beyond the standard requirements of device protection include integration of antennas, compatibility to photonic networks and direct transitions to waveguide systems. Techniques for electromagnetic analysis, thermal control and hermetic sealing were explored. Three dimensional electromagnetic analysis was performed using a finite-difference time-domain (FDTD) algorithm and experimentally verified for millimeter-wave package input and output transitions. New multi-material system concepts (AlN, Cu, and diamond thin films) which allow excellent surface finishes to be achieved with enhanced thermal management have been investigated. A new approach utilizing block copolymer coatings was employed to hermetically seal packages which met MIL STD-883.< > |
| doi_str_mv | 10.1109/22.392909 |
| format | Article |
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This package is well suited for discrete devices, monolithic microwave integrated circuits (MMIC's) and multichip module (MCM) applications. It has low-loss wideband RF transitions which are necessary to overcome manufacturing tolerances leading to lower per unit cost. Potential applications of this new packaging architecture which go beyond the standard requirements of device protection include integration of antennas, compatibility to photonic networks and direct transitions to waveguide systems. Techniques for electromagnetic analysis, thermal control and hermetic sealing were explored. Three dimensional electromagnetic analysis was performed using a finite-difference time-domain (FDTD) algorithm and experimentally verified for millimeter-wave package input and output transitions. New multi-material system concepts (AlN, Cu, and diamond thin films) which allow excellent surface finishes to be achieved with enhanced thermal management have been investigated. A new approach utilizing block copolymer coatings was employed to hermetically seal packages which met MIL STD-883.< ></description><identifier>ISSN: 0018-9480</identifier><identifier>EISSN: 1557-9670</identifier><identifier>DOI: 10.1109/22.392909</identifier><identifier>CODEN: IETMAB</identifier><language>eng</language><publisher>Jet Propulsion Laboratory: IEEE</publisher><subject>Application specific integrated circuits ; Applied sciences ; Electromagnetic analysis ; Electronic equipment and fabrication. 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This package is well suited for discrete devices, monolithic microwave integrated circuits (MMIC's) and multichip module (MCM) applications. It has low-loss wideband RF transitions which are necessary to overcome manufacturing tolerances leading to lower per unit cost. Potential applications of this new packaging architecture which go beyond the standard requirements of device protection include integration of antennas, compatibility to photonic networks and direct transitions to waveguide systems. Techniques for electromagnetic analysis, thermal control and hermetic sealing were explored. Three dimensional electromagnetic analysis was performed using a finite-difference time-domain (FDTD) algorithm and experimentally verified for millimeter-wave package input and output transitions. New multi-material system concepts (AlN, Cu, and diamond thin films) which allow excellent surface finishes to be achieved with enhanced thermal management have been investigated. A new approach utilizing block copolymer coatings was employed to hermetically seal packages which met MIL STD-883.< ></description><subject>Application specific integrated circuits</subject><subject>Applied sciences</subject><subject>Electromagnetic analysis</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Electronics And Electrical Engineering</subject><subject>Exact sciences and technology</subject><subject>Finite difference methods</subject><subject>Integrated circuit packaging</subject><subject>Materials science and technology</subject><subject>Microwave devices</subject><subject>Millimeter wave integrated circuits</subject><subject>Millimeter wave technology</subject><subject>Thermal management</subject><subject>Time domain analysis</subject><issn>0018-9480</issn><issn>1557-9670</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1995</creationdate><recordtype>article</recordtype><sourceid>CYI</sourceid><recordid>eNqNkb1PwzAQxS0EEqUwsCKGDgiJIeVsJ_4YUcWXVMECs-XYFwjko9hpEf89KalgLNPpdL_33kmPkGMKU0pBXzI25Zpp0DtkRLNMJlpI2CUjAKoSnSrYJwcxvvVrmoEakeShXWE16dC9NuXHEuOkaMOkLquqrLHDkHzaFU4W1r3bF4yHZK-wVcSjzRyT55vrp9ldMn-8vZ9dzROXMugSnvtcFpR6hpn33INDkdvMK5Fn6JlzVlnwFiVzkvY3J7VC5fJcFMx7oHxMzgffRWjXT3WmLqPDqrINtstomOZAKZfbQSUFFeI_YCqACbYdlKmiOuU9eDGALrQxBizMIpS1DV-Ggll3YRgzQxc9e7YxtdHZqgi2cWX8FXABQrF19umANTZa03QhGqq1BtBa_ricDOcSEf_EQ8Q3BaeY7Q</recordid><startdate>19950701</startdate><enddate>19950701</enddate><creator>Herman, M.I.</creator><creator>Lee, K.A.</creator><creator>Kolawa, E.A.</creator><creator>Lowry, L.E.</creator><creator>Tulintseff, A.N.</creator><general>IEEE</general><general>Institute of Electrical and Electronic Engineers</general><general>Institute of Electrical and Electronics Engineers</general><scope>CYE</scope><scope>CYI</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope><scope>7SP</scope><scope>7QQ</scope><scope>JG9</scope><scope>7QF</scope></search><sort><creationdate>19950701</creationdate><title>Novel techniques for millimeter-wave packages</title><author>Herman, M.I. ; Lee, K.A. ; Kolawa, E.A. ; Lowry, L.E. ; Tulintseff, A.N.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c420t-3bdb7f11d2e5dd3d0ce6ba5d86b5ed2cca8a0dae72c71ce6c798e8cbb6f2dd013</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1995</creationdate><topic>Application specific integrated circuits</topic><topic>Applied sciences</topic><topic>Electromagnetic analysis</topic><topic>Electronic equipment and fabrication. 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| identifier | ISSN: 0018-9480 |
| ispartof | IEEE transactions on microwave theory and techniques, 1995-07, Vol.43 (7), p.1516-1523 |
| issn | 0018-9480 1557-9670 |
| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Application specific integrated circuits Applied sciences Electromagnetic analysis Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Electronics And Electrical Engineering Exact sciences and technology Finite difference methods Integrated circuit packaging Materials science and technology Microwave devices Millimeter wave integrated circuits Millimeter wave technology Thermal management Time domain analysis |
| title | Novel techniques for millimeter-wave packages |
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