Electroplated metal microstructures embedded in fusion-bonded silicon: conductors and magnetic materials

Fabrication methods for integrating thick (tens or hundreds of micrometers) electroplated metallic microstructures inside fusion-bonded silicon wafers are proposed and validated. Cu and Ni/sub 80/Fe/sub 20/ (permalloy) test structures were embedded inside of cavities in silicon wafers, which were fu...

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Veröffentlicht in:	Journal of microelectromechanical systems 2004-10, Vol.13 (5), p.791-798
Hauptverfasser:	Arnold, D.P., Cros, F., Zana, I., Veazie, D.R., Allen, M.G.
Format:	Artikel
Sprache:	eng
Schlagworte:	Annealing Bonding strength Conducting materials Devices Electric resistance Fabrication Iron Magnetic materials Microelectromechanical systems Microstructure Silicon Testing Wafer bonding Wafers
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