Afterglow ground-state copper density behavior in kinetically enhanced copper vapor lasers
The interferometric "Hook" method has been used to measure the copper ground-state density during the interpulse period for a 38 mm bore diameter copper vapor laser (CVL) operated in kinetically enhanced (KE) mode (Ne-HCl-H/sub 2/ gas mixture) and in conventional mode (pure neon and Ne-H/s...
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| Veröffentlicht in: | IEEE journal of quantum electronics 1998-12, Vol.34 (12), p.2275-2278 |
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| container_end_page | 2278 |
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| container_issue | 12 |
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| container_title | IEEE journal of quantum electronics |
| container_volume | 34 |
| creator | Mildren, R.P. Withford, M.J. Brown, D.J.W. Carman, R.J. Piper, J.A. |
| description | The interferometric "Hook" method has been used to measure the copper ground-state density during the interpulse period for a 38 mm bore diameter copper vapor laser (CVL) operated in kinetically enhanced (KE) mode (Ne-HCl-H/sub 2/ gas mixture) and in conventional mode (pure neon and Ne-H/sub 2/ gas mixtures). It was found that the rate of regrowth of the axial copper density during the afterglow of the KE-CVL is 3-4 times faster, and the axial prepulse ground-state copper density is 2-3 times higher, than that observed for pure Ne or Ne-HI buffer gases. We conclude that the primary action of the HCl+H/sub 2/ additives is to increase the interpulse plasma relaxation rate and to increase the threshold copper density beyond which thermal runaway occurs. These effects are primarily responsible for the elevated pulse rates and increased pulse energies giving improved power scaling characteristics of KE-CVLs. |
| doi_str_mv | 10.1109/3.736089 |
| format | Article |
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It was found that the rate of regrowth of the axial copper density during the afterglow of the KE-CVL is 3-4 times faster, and the axial prepulse ground-state copper density is 2-3 times higher, than that observed for pure Ne or Ne-HI buffer gases. We conclude that the primary action of the HCl+H/sub 2/ additives is to increase the interpulse plasma relaxation rate and to increase the threshold copper density beyond which thermal runaway occurs. These effects are primarily responsible for the elevated pulse rates and increased pulse energies giving improved power scaling characteristics of KE-CVLs.</description><identifier>ISSN: 0018-9197</identifier><identifier>EISSN: 1558-1713</identifier><identifier>DOI: 10.1109/3.736089</identifier><identifier>CODEN: IEJQA7</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Additives ; Atomic measurements ; Copper ; Density measurement ; Exact sciences and technology ; Fundamental areas of phenomenology (including applications) ; Gas lasers ; Gas lasers including excimer and metal-vapor lasers ; Gases ; Kinetic theory ; Lasers ; Optics ; Physics ; Plasma density ; Plasma measurements ; Power generation</subject><ispartof>IEEE journal of quantum electronics, 1998-12, Vol.34 (12), p.2275-2278</ispartof><rights>1999 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c335t-ebcad5bc2e328a50cda2418feedec62ce35c59729b8d18856927aa0a1b2ca8f03</citedby><cites>FETCH-LOGICAL-c335t-ebcad5bc2e328a50cda2418feedec62ce35c59729b8d18856927aa0a1b2ca8f03</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/736089$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27923,27924,54757</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/736089$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=1603424$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Mildren, R.P.</creatorcontrib><creatorcontrib>Withford, M.J.</creatorcontrib><creatorcontrib>Brown, D.J.W.</creatorcontrib><creatorcontrib>Carman, R.J.</creatorcontrib><creatorcontrib>Piper, J.A.</creatorcontrib><title>Afterglow ground-state copper density behavior in kinetically enhanced copper vapor lasers</title><title>IEEE journal of quantum electronics</title><addtitle>JQE</addtitle><description>The interferometric "Hook" method has been used to measure the copper ground-state density during the interpulse period for a 38 mm bore diameter copper vapor laser (CVL) operated in kinetically enhanced (KE) mode (Ne-HCl-H/sub 2/ gas mixture) and in conventional mode (pure neon and Ne-H/sub 2/ gas mixtures). It was found that the rate of regrowth of the axial copper density during the afterglow of the KE-CVL is 3-4 times faster, and the axial prepulse ground-state copper density is 2-3 times higher, than that observed for pure Ne or Ne-HI buffer gases. We conclude that the primary action of the HCl+H/sub 2/ additives is to increase the interpulse plasma relaxation rate and to increase the threshold copper density beyond which thermal runaway occurs. These effects are primarily responsible for the elevated pulse rates and increased pulse energies giving improved power scaling characteristics of KE-CVLs.</description><subject>Additives</subject><subject>Atomic measurements</subject><subject>Copper</subject><subject>Density measurement</subject><subject>Exact sciences and technology</subject><subject>Fundamental areas of phenomenology (including applications)</subject><subject>Gas lasers</subject><subject>Gas lasers including excimer and metal-vapor lasers</subject><subject>Gases</subject><subject>Kinetic theory</subject><subject>Lasers</subject><subject>Optics</subject><subject>Physics</subject><subject>Plasma density</subject><subject>Plasma measurements</subject><subject>Power generation</subject><issn>0018-9197</issn><issn>1558-1713</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1998</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqNkE1Lw0AQQBdRsFbBs6ccRLyk7kc22T2WUj-g4EUvXsJkM2lX0yTubiv996ak6tXTMMzjDTxCLhmdMEb1nZhkIqVKH5ERk1LFLGPimIwoZSrWTGen5Mz7935NEkVH5G1aBXTLuv2Klq7dNGXsAwSMTNt16KISG2_DLipwBVvbusg20YdtMFgDdb2LsFlBY7D84bfQ9VANHp0_JycV1B4vDnNMXu_nL7PHePH88DSbLmIjhAwxFgZKWRiOgiuQ1JTAE6YqxBJNyg0KaaTOuC5UyZSSqeYZAAVWcAOqomJMbgZv59rPDfqQr603WNfQYLvxOVepypRM_gFyTUW2N94OoHGt9w6rvHN2DW6XM5rvK-ciHyr36PXBCb5PUrk-h_V_fEpFwvevrwbMIuLv9eD4BlFvhe4</recordid><startdate>19981201</startdate><enddate>19981201</enddate><creator>Mildren, R.P.</creator><creator>Withford, M.J.</creator><creator>Brown, D.J.W.</creator><creator>Carman, R.J.</creator><creator>Piper, J.A.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><scope>8BQ</scope><scope>JG9</scope></search><sort><creationdate>19981201</creationdate><title>Afterglow ground-state copper density behavior in kinetically enhanced copper vapor lasers</title><author>Mildren, R.P. ; Withford, M.J. ; Brown, D.J.W. ; Carman, R.J. ; Piper, J.A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c335t-ebcad5bc2e328a50cda2418feedec62ce35c59729b8d18856927aa0a1b2ca8f03</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1998</creationdate><topic>Additives</topic><topic>Atomic measurements</topic><topic>Copper</topic><topic>Density measurement</topic><topic>Exact sciences and technology</topic><topic>Fundamental areas of phenomenology (including applications)</topic><topic>Gas lasers</topic><topic>Gas lasers including excimer and metal-vapor lasers</topic><topic>Gases</topic><topic>Kinetic theory</topic><topic>Lasers</topic><topic>Optics</topic><topic>Physics</topic><topic>Plasma density</topic><topic>Plasma measurements</topic><topic>Power generation</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Mildren, R.P.</creatorcontrib><creatorcontrib>Withford, M.J.</creatorcontrib><creatorcontrib>Brown, D.J.W.</creatorcontrib><creatorcontrib>Carman, R.J.</creatorcontrib><creatorcontrib>Piper, J.A.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>METADEX</collection><collection>Materials Research Database</collection><jtitle>IEEE journal of quantum electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Mildren, R.P.</au><au>Withford, M.J.</au><au>Brown, D.J.W.</au><au>Carman, R.J.</au><au>Piper, J.A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Afterglow ground-state copper density behavior in kinetically enhanced copper vapor lasers</atitle><jtitle>IEEE journal of quantum electronics</jtitle><stitle>JQE</stitle><date>1998-12-01</date><risdate>1998</risdate><volume>34</volume><issue>12</issue><spage>2275</spage><epage>2278</epage><pages>2275-2278</pages><issn>0018-9197</issn><eissn>1558-1713</eissn><coden>IEJQA7</coden><abstract>The interferometric "Hook" method has been used to measure the copper ground-state density during the interpulse period for a 38 mm bore diameter copper vapor laser (CVL) operated in kinetically enhanced (KE) mode (Ne-HCl-H/sub 2/ gas mixture) and in conventional mode (pure neon and Ne-H/sub 2/ gas mixtures). It was found that the rate of regrowth of the axial copper density during the afterglow of the KE-CVL is 3-4 times faster, and the axial prepulse ground-state copper density is 2-3 times higher, than that observed for pure Ne or Ne-HI buffer gases. We conclude that the primary action of the HCl+H/sub 2/ additives is to increase the interpulse plasma relaxation rate and to increase the threshold copper density beyond which thermal runaway occurs. These effects are primarily responsible for the elevated pulse rates and increased pulse energies giving improved power scaling characteristics of KE-CVLs.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/3.736089</doi><tpages>4</tpages></addata></record> |
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| ispartof | IEEE journal of quantum electronics, 1998-12, Vol.34 (12), p.2275-2278 |
| issn | 0018-9197 1558-1713 |
| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Additives Atomic measurements Copper Density measurement Exact sciences and technology Fundamental areas of phenomenology (including applications) Gas lasers Gas lasers including excimer and metal-vapor lasers Gases Kinetic theory Lasers Optics Physics Plasma density Plasma measurements Power generation |
| title | Afterglow ground-state copper density behavior in kinetically enhanced copper vapor lasers |
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