The new immersion tin generation in practical operation - a surface finish process including the world's first organic metal

This paper describes the properties of a new generation of immersion tin as a solderable surface finish for printed circuit boards. The new process combines the unique technology of Organic Metals with the well introduced technology of immersion tin. A comparison with other solderable surface finish...

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Veröffentlicht in:	Circuit world 2003-03, Vol.29 (1), p.10-13
1. Verfasser:	Schroder, Sabine
Format:	Artikel
Sprache:	eng
Schlagworte:	Aging Copper Intermetallic compounds Lead Metals OEM Oxidation Polymers Printed circuit boards Solderability Soldering Studies Tin
Online-Zugang:	Volltext
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