Thermal characterization of diamond-pressure-bond heat sinking for optically pumped mid-infrared lasers

Thermal characterization of diamond-pressure-bond heat sinking for optically pumped mid-infrared lasers

The heat-sinking properties of optically pumped semiconductor lasers mounted by the diamond-pressure-bonding (DPB) technique have been evaluated quantitatively. This method combines epi-side-down mounting with minimal processing and top optical access via pumping through the diamond. By correlating...

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Veröffentlicht in:IEEE journal of quantum electronics 1999-11, Vol.35 (11), p.1597-1601
Hauptverfasser: Bewley, W.W., Felix, C.L., Aifer, E.H., Stokes, D.W., Vurgaftman, I., Olafsen, L.J., Meyer, J.R., Yang, M.J., Lee, H.
Format: Artikel
Sprache:eng
Schlagworte:
Continuous operation
Diamonds
Emission
Exact sciences and technology
Fundamental areas of phenomenology (including applications)
Heat pumps
Heat sinks
Laser excitation
Laser optical systems: design and operation
Lasers
Mounting
Optical data processing
Optical pumping
Optical sensors
Optics
Physics
Pump lasers
Resistance heating
Semiconductor lasers
Semiconductor lasers
laser diodes
Stimulated emission
Thermal resistance
Wavelengths
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Zusammenfassung:The heat-sinking properties of optically pumped semiconductor lasers mounted by the diamond-pressure-bonding (DPB) technique have been evaluated quantitatively. This method combines epi-side-down mounting with minimal processing and top optical access via pumping through the diamond. By correlating the pump-intensity variation of the emission wavelength with its temperature variation, specific thermal resistances have been determined for DPB-mounted type-II "W" lasers operating in the mid-infrared. Values
ISSN:0018-9197
1558-1713
DOI:10.1109/3.798081