Diffusion barrier integrity and electrical performance of Cu/porous dielectric damascene lines

One issue accompanying the introduction of porous dielectrics in Cu damascene interconnects is the integrity of diffusion barriers. For the first time a direct correlation is shown between the physical integrity of the barrier layer and the electrical performance of damascene lines embedded in a die...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE electron device letters 2003-03, Vol.24 (3), p.147-149
Hauptverfasser:	Iacopi, F., Tokei, Zs, Stucchi, M., Lanckmans, F., Maex, K.
Format:	Artikel
Sprache:	eng
Schlagworte:	Barrier layers Barriers Breakdown Chemical vapor deposition CONNECTORS (ELECTRICAL) Copper Dielectrics DIFFUSION DIFFUSION BARRIERS Electric breakdown INLAYS INSULATION (ELECTRICAL) Integrity LAN interconnection Leakage current Permittivity Plasma measurements Plasma temperature POROSITY Testing Thermal stresses
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!