Aging treatment characteristics of solder bump joint for high reliability optical module
The joint strength and fracture surfaces of Sn–37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn–37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC...
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| Veröffentlicht in: | Thin solid films 2004-09, Vol.462 (Complete), p.402-407 |
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| container_title | Thin solid films |
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| creator | Kim, Kyung-Seob Yu, Chung-Hee Yang, Jun-Mo |
| description | The joint strength and fracture surfaces of Sn–37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn–37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu
6Sn
5, scallop-shaped IMCs, and planar-shaped Cu
3Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction. |
| doi_str_mv | 10.1016/j.tsf.2004.05.064 |
| format | Article |
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6Sn
5, scallop-shaped IMCs, and planar-shaped Cu
3Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction.</description><identifier>ISSN: 0040-6090</identifier><identifier>EISSN: 1879-2731</identifier><identifier>DOI: 10.1016/j.tsf.2004.05.064</identifier><language>eng</language><publisher>Elsevier B.V</publisher><subject>Intermetallic compound ; Solder bump ; Stud bump ; Thermal aging</subject><ispartof>Thin solid films, 2004-09, Vol.462 (Complete), p.402-407</ispartof><rights>2004 Elsevier B.V.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c357t-5901d0858bd0835be29a5a1c9e8a56ca5dff0a44e9f63c50de9711855be7126f3</citedby><cites>FETCH-LOGICAL-c357t-5901d0858bd0835be29a5a1c9e8a56ca5dff0a44e9f63c50de9711855be7126f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.tsf.2004.05.064$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids></links><search><creatorcontrib>Kim, Kyung-Seob</creatorcontrib><creatorcontrib>Yu, Chung-Hee</creatorcontrib><creatorcontrib>Yang, Jun-Mo</creatorcontrib><title>Aging treatment characteristics of solder bump joint for high reliability optical module</title><title>Thin solid films</title><description>The joint strength and fracture surfaces of Sn–37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn–37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu
6Sn
5, scallop-shaped IMCs, and planar-shaped Cu
3Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction.</description><subject>Intermetallic compound</subject><subject>Solder bump</subject><subject>Stud bump</subject><subject>Thermal aging</subject><issn>0040-6090</issn><issn>1879-2731</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><recordid>eNqNkE1LAzEQQIMoWKs_wFtO3nadZJvsLp5K8QsKXhS8hTQ7aVN2m5pkhf57U-pZvGQOeW9gHiG3DEoGTN5vyxRtyQFmJYgS5OyMTFhTtwWvK3ZOJvkDCgktXJKrGLcAwDivJuRzvna7NU0BdRpwl6jZ6KBNwuBiciZSb2n0fYeBrsZhT7feZcj6QDduvaEBe6dXrnfpQP0-C7qng-_GHq_JhdV9xJvfOSUfT4_vi5di-fb8upgvC1OJOhWiBdZBI5pVfiuxQt5qoZlpsdFCGi06a0HPZthaWRkBHbY1Y43IZM24tNWU3J327oP_GjEmNbhosO_1Dv0YFW-krCvg_wCZ5FKyDLITaIKPMaBV--AGHQ6KgTrGVluVY6tjbAVC5djZeTg5mE_9dhhUNA53BjsX0CTVefeH_QP9f4iB</recordid><startdate>20040901</startdate><enddate>20040901</enddate><creator>Kim, Kyung-Seob</creator><creator>Yu, Chung-Hee</creator><creator>Yang, Jun-Mo</creator><general>Elsevier B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7TB</scope><scope>8BQ</scope><scope>8FD</scope><scope>FR3</scope><scope>JG9</scope><scope>KR7</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20040901</creationdate><title>Aging treatment characteristics of solder bump joint for high reliability optical module</title><author>Kim, Kyung-Seob ; Yu, Chung-Hee ; Yang, Jun-Mo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c357t-5901d0858bd0835be29a5a1c9e8a56ca5dff0a44e9f63c50de9711855be7126f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Intermetallic compound</topic><topic>Solder bump</topic><topic>Stud bump</topic><topic>Thermal aging</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kim, Kyung-Seob</creatorcontrib><creatorcontrib>Yu, Chung-Hee</creatorcontrib><creatorcontrib>Yang, Jun-Mo</creatorcontrib><collection>CrossRef</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Materials Research Database</collection><collection>Civil Engineering Abstracts</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Thin solid films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kim, Kyung-Seob</au><au>Yu, Chung-Hee</au><au>Yang, Jun-Mo</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Aging treatment characteristics of solder bump joint for high reliability optical module</atitle><jtitle>Thin solid films</jtitle><date>2004-09-01</date><risdate>2004</risdate><volume>462</volume><issue>Complete</issue><spage>402</spage><epage>407</epage><pages>402-407</pages><issn>0040-6090</issn><eissn>1879-2731</eissn><abstract>The joint strength and fracture surfaces of Sn–37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn–37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu
6Sn
5, scallop-shaped IMCs, and planar-shaped Cu
3Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction.</abstract><pub>Elsevier B.V</pub><doi>10.1016/j.tsf.2004.05.064</doi><tpages>6</tpages></addata></record> |
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| ispartof | Thin solid films, 2004-09, Vol.462 (Complete), p.402-407 |
| issn | 0040-6090 1879-2731 |
| language | eng |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Intermetallic compound Solder bump Stud bump Thermal aging |
| title | Aging treatment characteristics of solder bump joint for high reliability optical module |
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