Study on underfill/solder adhesion in flip-chip encapsulation

Underfill materials are employed in flip-chip assemblies to enhance solder joint reliability performance. We have studied the adhesion strength of two underfill samples with tin/lead (Sn/Pb) eutectic solder and tin/copper (Sn/Cu) lead-free solder, benchmarked with a copper surface. It was found that...

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Veröffentlicht in:	IEEE transactions on advanced packaging 2002-11, Vol.25 (4), p.473-480
Hauptverfasser:	Lianhua Fan, Tison, C.K., Wong, C.P.
Format:	Artikel
Sprache:	eng
Schlagworte:	Additives Adhesion Adhesive strength Adhesives Aging Applied sciences Copper Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Encapsulation Environmentally friendly manufacturing techniques Exact sciences and technology Flux Lead Lead (metal) Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solders Strength Surface tension Testing Testing, measurement, noise and reliability Tin
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