Stacked modular package

This paper reports on a vertical package developed to enable size reduction of electronics for miniaturized products. The features of portable and handheld devices have increased whereas size is continually reduced. System-on-a-chip is the most effective size reduction approach, but is not a good bu...

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Veröffentlicht in:	IEEE transactions on advanced packaging 2004-08, Vol.27 (3), p.461-466
Hauptverfasser:	Pienimaa, S.K., Miettinen, J., Ristolainen, E.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Assembly systems Chips Design. Technologies. Operation analysis. Testing Electronics Electronics packaging Exact sciences and technology Failure Flip chip Handheld computers Integrated circuits Interconnections Joints Modular Modules Packages Plastics Polymers Routing Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solders Stacking System-on-a-chip Testing Thermal cycling
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