On the thermal aspects of ductile regime micro-scratching of single crystal silicon for NEMS/MEMS applications
Ductile regime machining, DRM, of silicon offers an advantageous alternative to produce a material base that is suitable for MEMS/NEMS fabrication. DRM of brittle materials is due to the joined influence of a thermal and a mechanical effect. Due to the relative facility by which the mechanical behav...
Gespeichert in:
Veröffentlicht in: | Wear 2005-07, Vol.259 (7), p.1343-1351 |
---|---|
Hauptverfasser: | , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!