Relaxation effects in NMOS transistors after hot-carrier stressing

Aging studies on NMOS transistors with dry oxides at room temperature have revealed that the creation of interface traps and the trapping of positive charge in the oxide associated with hot-electron effects are not permanent, but can be reversed to some extent if the transistor drain is grounded and...

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Veröffentlicht in:IEEE electron device letters 1987-05, Vol.8 (5), p.234-236
Hauptverfasser: Doyle, B.S., Bourcerie, M., Marchetaux, J.-C., Boudou, A.
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container_issue 5
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container_title IEEE electron device letters
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creator Doyle, B.S.
Bourcerie, M.
Marchetaux, J.-C.
Boudou, A.
description Aging studies on NMOS transistors with dry oxides at room temperature have revealed that the creation of interface traps and the trapping of positive charge in the oxide associated with hot-electron effects are not permanent, but can be reversed to some extent if the transistor drain is grounded and left for some time. The relaxation is a substantial fraction of the original degradation at low degradation values and suggests that there is an annealing of some of the traps created by stressing. This annealing follows first-order kinetics for both created interface traps and trapped oxide charge, and is characterized by relaxation times τ r of 600-900 s.
doi_str_mv 10.1109/EDL.1987.26614
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source IEEE Electronic Library (IEL)
subjects Aging
Annealing
Applied sciences
Atmospheric measurements
Degradation
Electronics
Exact sciences and technology
Hot carrier effects
Hot carriers
Kinetic theory
MOSFETs
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Temperature
Threshold voltage
Transistors
title Relaxation effects in NMOS transistors after hot-carrier stressing
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